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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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Description
  • Vodivá lepidla a pájky jsou užívány pro montáž elektronických součástek. Jejich výběr je prováděn podle řady různých kritérií. Aplikace jednotlivých spojovacích materiálů se řídí výsledky provedených testů. (cs)
  • Conductive adhesives and solder materials are used for assembly of electronic components. The selection of them has got a large number of valuation criteria. The use of new adhesive material and different solders depends on results of tests about their properties.
  • Conductive adhesives and solder materials are used for assembly of electronic components. The selection of them has got a large number of valuation criteria. The use of new adhesive material and different solders depends on results of tests about their properties. (en)
Title
  • Evaluation and Selection Methods of Conductive Adhesives and Solder Materials
  • Evaluation and Selection Methods of Conductive Adhesives and Solder Materials (en)
  • Výběr hodnod hodnocení vodivých lepidel a pájek (cs)
skos:prefLabel
  • Evaluation and Selection Methods of Conductive Adhesives and Solder Materials
  • Evaluation and Selection Methods of Conductive Adhesives and Solder Materials (en)
  • Výběr hodnod hodnocení vodivých lepidel a pájek (cs)
skos:notation
  • RIV/68407700:21230/07:03132710!RIV08-MSM-21230___
http://linked.open.../vavai/riv/strany
  • 214;215
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • Z(MSM6840770021)
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 420700
http://linked.open...ai/riv/idVysledku
  • RIV/68407700:21230/07:03132710
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • Material Selection; Solder Materials (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [F4A05DA34838]
http://linked.open...v/mistoKonaniAkce
  • Cluj-Napoca
http://linked.open...i/riv/mistoVydani
  • Cluj-Napoca
http://linked.open...i/riv/nazevZdroje
  • ISSE 2007 -30th International Spring Seminar on Electronics Technology 2007
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...UplatneniVysledku
http://linked.open...iv/tvurceVysledku
  • Mach, Pavel
  • Bauer, R.
  • Friese, M.
http://linked.open...vavai/riv/typAkce
http://linked.open.../riv/zahajeniAkce
http://linked.open...n/vavai/riv/zamer
number of pages
http://purl.org/ne...btex#hasPublisher
  • Technical University
https://schema.org/isbn
  • 978-973-713-174-4
http://localhost/t...ganizacniJednotka
  • 21230
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