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rdf:type
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Description
| - Properties of different methods of magnetron sputtering (dc-MS, dual-MS and dual-HiPIMS) are studied and compared with respect to intermetallic Ti-Cu film formation. The quality and features of thin films are strongly influenced by the energy of incoming particles. The ion velocity distribution functions (IVDFs) were measured by time-resolved retarding field analyzer (RFA) in the substrate position. Thin films were characterized by X-ray photoelectron spectroscopy (XPS), X-ray diffractometry (XRD) and X-ray reflectometry (XR). It was found that IVDFs measured in pulsed discharges exhibit double-peak distribution. The IVDFs reach the maximum at ion energies about 8 eV. The ion saturated current is highest in dual-HiPIMS discharge (5 μA/cm2) and is mostly represented by Cu+ and Ar+ ions. The mode of sputtering influences chemical composition. The copper forms polycrystalline fcc-phase while much smaller Ti particles enwraps the copper crystallites or are part of a solid solution.
- Properties of different methods of magnetron sputtering (dc-MS, dual-MS and dual-HiPIMS) are studied and compared with respect to intermetallic Ti-Cu film formation. The quality and features of thin films are strongly influenced by the energy of incoming particles. The ion velocity distribution functions (IVDFs) were measured by time-resolved retarding field analyzer (RFA) in the substrate position. Thin films were characterized by X-ray photoelectron spectroscopy (XPS), X-ray diffractometry (XRD) and X-ray reflectometry (XR). It was found that IVDFs measured in pulsed discharges exhibit double-peak distribution. The IVDFs reach the maximum at ion energies about 8 eV. The ion saturated current is highest in dual-HiPIMS discharge (5 μA/cm2) and is mostly represented by Cu+ and Ar+ ions. The mode of sputtering influences chemical composition. The copper forms polycrystalline fcc-phase while much smaller Ti particles enwraps the copper crystallites or are part of a solid solution. (en)
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Title
| - Growth and properties of Ti-Cu films with respect to plasma parameters in dual-magnetron sputtering discharges
- Growth and properties of Ti-Cu films with respect to plasma parameters in dual-magnetron sputtering discharges (en)
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skos:prefLabel
| - Growth and properties of Ti-Cu films with respect to plasma parameters in dual-magnetron sputtering discharges
- Growth and properties of Ti-Cu films with respect to plasma parameters in dual-magnetron sputtering discharges (en)
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skos:notation
| - RIV/68378271:_____/11:00373839!RIV12-AV0-68378271
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http://linked.open...avai/riv/aktivita
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http://linked.open...avai/riv/aktivity
| - P(1M06002), P(GAP205/11/0386), P(GP202/09/P159), P(KAN301370701), S, Z(AV0Z10100522), Z(MSM0021620834)
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http://linked.open...iv/cisloPeriodika
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http://linked.open...vai/riv/dodaniDat
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http://linked.open...aciTvurceVysledku
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http://linked.open.../riv/druhVysledku
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http://linked.open...iv/duvernostUdaju
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http://linked.open...titaPredkladatele
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http://linked.open...dnocenehoVysledku
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http://linked.open...ai/riv/idVysledku
| - RIV/68378271:_____/11:00373839
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http://linked.open...riv/jazykVysledku
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http://linked.open.../riv/klicovaSlova
| - dual magnetron; Ti-Cu film; HiPIMS; diagnostics; ion energy (en)
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http://linked.open.../riv/klicoveSlovo
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http://linked.open...odStatuVydavatele
| - DE - Spolková republika Německo
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http://linked.open...ontrolniKodProRIV
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http://linked.open...i/riv/nazevZdroje
| - European Physical Journal D
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http://linked.open...in/vavai/riv/obor
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http://linked.open...ichTvurcuVysledku
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http://linked.open...cetTvurcuVysledku
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http://linked.open...vavai/riv/projekt
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http://linked.open...UplatneniVysledku
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http://linked.open...v/svazekPeriodika
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http://linked.open...iv/tvurceVysledku
| - Hubička, Zdeněk
- Bogdanowicz, R.
- Drache, S.
- Hippler, R.
- Straňák, V.
- Čada, Martin
- Tichý, M.
- Wulff, H.
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http://linked.open...ain/vavai/riv/wos
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http://linked.open...n/vavai/riv/zamer
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issn
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number of pages
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http://bibframe.org/vocab/doi
| - 10.1140/epjd/e2011-20393-7
|