About: Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	The substitution of lead in the electronics industry is one of the key issues in the current drive towards ecological manufacturing. Legislation has already banned the use of lead in solders for mainstream applications (T M 220 °C), but the use of lead in the solders for high-temperature applications (>85% lead, T M 250-350 °C) is still exempt in RoHS2. The search for proper substitutes has been ongoing among solder manufacturers only for a decade without finding a viable low cost alternative and is the subject of intensive research. This article tries to map the current situation in the field of high-temperature lead-free soldering, presenting a short review of current legislation, requirements for substitute alloys, and finally it describes some existing solutions both in the field of promising new materials and new technologies. Currently, there is no drop-in replacement for lead-containing solders and therefore both the new materials and the new technologies may be viable solutions for production of reliable lead-free joints for high-temperature applications. The substitution of lead in the electronics industry is one of the key issues in the current drive towards ecological manufacturing. Legislation has already banned the use of lead in solders for mainstream applications (T M 220 °C), but the use of lead in the solders for high-temperature applications (>85% lead, T M 250-350 °C) is still exempt in RoHS2. The search for proper substitutes has been ongoing among solder manufacturers only for a decade without finding a viable low cost alternative and is the subject of intensive research. This article tries to map the current situation in the field of high-temperature lead-free soldering, presenting a short review of current legislation, requirements for substitute alloys, and finally it describes some existing solutions both in the field of promising new materials and new technologies. Currently, there is no drop-in replacement for lead-containing solders and therefore both the new materials and the new technologies may be viable solutions for production of reliable lead-free joints for high-temperature applications. (en)
Title	Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering (en)
skos:prefLabel	Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering (en)
skos:notation	RIV/68081723:_____/12:00386299!RIV13-AV0-68081723
http://linked.open...avai/riv/aktivita	I
http://linked.open...avai/riv/aktivity	I
http://linked.open...iv/cisloPeriodika	5
http://linked.open...vai/riv/dodaniDat	2013
http://linked.open...aciTvurceVysledku	Kroupa, Aleš
http://linked.open.../riv/druhVysledku	J - Článek v odborném periodiku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Ústav fyziky materiálů AV ČR, v. v. i.
http://linked.open...dnocenehoVysledku	129264
http://linked.open...ai/riv/idVysledku	RIV/68081723:_____/12:00386299
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	lead-free soldering,; materials for high-temperature LF; new technologies for HT lead-free soldering (en)
http://linked.open.../riv/klicoveSlovo	lead-free soldering materials for high-temperature LF new technologies for HT lead-free soldering
http://linked.open...odStatuVydavatele	US - Spojené státy americké
http://linked.open...ontrolniKodProRIV	[3F55CCAAD0F9]
http://linked.open...i/riv/nazevZdroje	Journal of Materials Engineering and Performance
http://linked.open...in/vavai/riv/obor	BJ
http://linked.open...ichTvurcuVysledku	1 (xsd:int)
http://linked.open...cetTvurcuVysledku	7 (xsd:int)
http://linked.open...UplatneniVysledku	2012
http://linked.open...v/svazekPeriodika	21
http://linked.open...iv/tvurceVysledku	Dinsdale, A. Kroupa, Aleš Watson, A. Andersson, D. Hoo, N. Mucklejohn, S. Pearce, J.
http://linked.open...ain/vavai/riv/wos	000303455900010
issn	1059-9495
number of pages	9 (xsd:int)
http://bibframe.org/vocab/doi	10.1007/s11665-012-0125-3

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