About: Study of interaction between copper and melt of lead-free solders

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	Problems of reactive diffusion at the interface solid phase - melt were studied theoretically and experimentally. A theoretical description of the kinetics of dissolution of the solid phase in the melt will be presented for the case of planar dissolution. The main intention was to study experimentally the copper dissolution in melts of various solder alloys and the related reactive diffusion. We used pure Sn and Sn-Cu, Sn-Ag-Cu, Sn-Sb, Sn-Zn alloys as solder materials. Experiments aimed at the study of a Cu plate dissolving in the solder melt were carried out at various conditions. Concentration profiles of elements and thickness of layers of phases were determined by SEM and X-ray microanalyses (WDX, EDX) of specimens after their heating. Problems of reactive diffusion at the interface solid phase - melt were studied theoretically and experimentally. A theoretical description of the kinetics of dissolution of the solid phase in the melt will be presented for the case of planar dissolution. The main intention was to study experimentally the copper dissolution in melts of various solder alloys and the related reactive diffusion. We used pure Sn and Sn-Cu, Sn-Ag-Cu, Sn-Sb, Sn-Zn alloys as solder materials. Experiments aimed at the study of a Cu plate dissolving in the solder melt were carried out at various conditions. Concentration profiles of elements and thickness of layers of phases were determined by SEM and X-ray microanalyses (WDX, EDX) of specimens after their heating. (en)
Title	Study of interaction between copper and melt of lead-free solders Study of interaction between copper and melt of lead-free solders (en)
skos:prefLabel	Study of interaction between copper and melt of lead-free solders Study of interaction between copper and melt of lead-free solders (en)
skos:notation	RIV/61989100:27360/13:86088412!RIV14-MSM-27360___
http://linked.open...avai/riv/aktivita	P
http://linked.open...avai/riv/aktivity	P(ED0040/01/01), P(OC08032)
http://linked.open...iv/cisloPeriodika	4
http://linked.open...vai/riv/dodaniDat	2014
http://linked.open...aciTvurceVysledku	Drápala, Jaromír Kostiuková, Gabriela
http://linked.open.../riv/druhVysledku	J - Článek v odborném periodiku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoká škola báňská - Technická univerzita Ostrava / Fakulta metalurgie a materiálového inženýrství
http://linked.open...dnocenehoVysledku	108718
http://linked.open...ai/riv/idVysledku	RIV/61989100:27360/13:86088412
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	diffusion; intermetallic compounds; silver; tin; copper; lead-free solders (en)
http://linked.open.../riv/klicoveSlovo	copper lead-free solders diffusion silver tin intermetallic compounds
http://linked.open...odStatuVydavatele	HR - Chorvatská republika
http://linked.open...ontrolniKodProRIV	[DF77F66D9AAB]
http://linked.open...i/riv/nazevZdroje	Metalurgija = Metallurgy
http://linked.open...in/vavai/riv/obor	JG
http://linked.open...ichTvurcuVysledku	2 (xsd:int)
http://linked.open...cetTvurcuVysledku	4 (xsd:int)
http://linked.open...vavai/riv/projekt	Theoretical and experimental study of phase equilibria in solder materials for high-temperature applications Regional materials science and technology centre
http://linked.open...UplatneniVysledku	2013
http://linked.open...v/svazekPeriodika	52
http://linked.open...iv/tvurceVysledku	Drápala, Jaromír Kostiuková, Gabriela Kubíček, P. Jopek, P.
http://linked.open...ain/vavai/riv/wos	000318059400019
issn	0543-5846
number of pages	3 (xsd:int)
http://localhost/t...ganizacniJednotka	27360

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