About: Reactive diffusion upon planar dissolving of copper in solder melts

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	Problems of reactive diffusion at a solid phase - melt contact were studied theoretically. The main intention was to calculate the time course of the solid phase dissolving in the case of planar dissolving. A theoretical description of the kinetics of solid phase dissolving in the melt will be presented for the case of planar dissolving. The aim is to derive a relation for the interphase boundary movement depending on time and a time course of growth of the element A concentration in the melt B. The main intention was to study experimentally the copper dissolving in melts of various solder alloys and the related reactive diffusion. We used pure Sn and Sn-Cu, Sn-Ag-Cu, Sn-Sb, Sn-Zn alloys as solder materials. Experiments aimed at the study of a Cu plate dissolving in the solder melt were carried out at various selected temperatures and times. The problems of reactive diffusion were studied both theoretically and experimentally and the problems that have to be solved preferably were emphasized. Concentration profiles of elements and thickness of layers of phases can be determined with SEM and X-ray microanalyses (WDX, EDX) of specimens after their diffusion heating. Problems of reactive diffusion at a solid phase - melt contact were studied theoretically. The main intention was to calculate the time course of the solid phase dissolving in the case of planar dissolving. A theoretical description of the kinetics of solid phase dissolving in the melt will be presented for the case of planar dissolving. The aim is to derive a relation for the interphase boundary movement depending on time and a time course of growth of the element A concentration in the melt B. The main intention was to study experimentally the copper dissolving in melts of various solder alloys and the related reactive diffusion. We used pure Sn and Sn-Cu, Sn-Ag-Cu, Sn-Sb, Sn-Zn alloys as solder materials. Experiments aimed at the study of a Cu plate dissolving in the solder melt were carried out at various selected temperatures and times. The problems of reactive diffusion were studied both theoretically and experimentally and the problems that have to be solved preferably were emphasized. Concentration profiles of elements and thickness of layers of phases can be determined with SEM and X-ray microanalyses (WDX, EDX) of specimens after their diffusion heating. (en)
Title	Reactive diffusion upon planar dissolving of copper in solder melts Reactive diffusion upon planar dissolving of copper in solder melts (en)
skos:prefLabel	Reactive diffusion upon planar dissolving of copper in solder melts Reactive diffusion upon planar dissolving of copper in solder melts (en)
skos:notation	RIV/61989100:27360/11:86081171!RIV12-MSM-27360___
http://linked.open...avai/riv/aktivita	P S Z
http://linked.open...avai/riv/aktivity	P(OC08032), S, Z(MSM0021620834), Z(MSM6198910013)
http://linked.open...iv/cisloPeriodika	duben
http://linked.open...vai/riv/dodaniDat	2012
http://linked.open...aciTvurceVysledku	Drápala, Jaromír Petlák, Daniel
http://linked.open.../riv/druhVysledku	J - Článek v odborném periodiku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoká škola báňská - Technická univerzita Ostrava / Fakulta metalurgie a materiálového inženýrství
http://linked.open...dnocenehoVysledku	225773
http://linked.open...ai/riv/idVysledku	RIV/61989100:27360/11:86081171
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	solders; silver; antimony; zinc; tin; copper; planar dissolving; Reactive diffusion (en)
http://linked.open.../riv/klicoveSlovo	copper zinc silver tin antimony solders Reactive diffusion planar dissolving
http://linked.open...odStatuVydavatele	CH - Švýcarská konfederace
http://linked.open...ontrolniKodProRIV	[72AB81D03708]
http://linked.open...i/riv/nazevZdroje	Defect and Diffusion Forum
http://linked.open...in/vavai/riv/obor	JG
http://linked.open...ichTvurcuVysledku	2 (xsd:int)
http://linked.open...cetTvurcuVysledku	5 (xsd:int)
http://linked.open...vavai/riv/projekt	Theoretical and experimental study of phase equilibria in solder materials for high-temperature applications
http://linked.open...UplatneniVysledku	2011
http://linked.open...v/svazekPeriodika	309-310
http://linked.open...iv/tvurceVysledku	Drápala, Jaromír Kubíček, Petr Petlák, Daniel Harcuba, Petr Jopek, Pavel
http://linked.open...ain/vavai/riv/wos	000291709300014
http://linked.open...n/vavai/riv/zamer	Condensed Matter Physics – New Materials and Technologies Processes of preparation and properties of highly pure and structural defined special materials
issn	1012-0386
number of pages	6 (xsd:int)
http://bibframe.org/vocab/doi	10.4028/www.scientific.net/DDF.309-310.127
http://localhost/t...ganizacniJednotka	27360

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