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  • The results of the study of Al-Sn-Zn system which can be a possible lead-free solder candidate for high temperature-applications in electronics and for automotive industry are presented in this paper. Six binary Sn-Zn and fourteen ternary Al-Sn-Zn alloys with 0.6 to 3 wt. % Al were prepared experimentally (melting in the electrical resistance furnace and casting into a graphite mould). The alloys were studied metallographically, the micro-hardness, their overall chemical composition (ICP-AES and OES on the Spectromax device) and X-ray micro-analysis (EDAX, WDX) of the coexisting phases were measured, too. Temperatures of liquidus, solidus and other transformation reactions and latent heats of melting and solidifying were investigated applying the DTA method. Experiments were performed with Setaram SETSYS 18TM experimental laboratory system for thermal analysis. Samples of selected alloys were analysed at linear heating/cooling rate of 4°C/min in the atmosphere of high pure argon. Resulting experimenta
  • The results of the study of Al-Sn-Zn system which can be a possible lead-free solder candidate for high temperature-applications in electronics and for automotive industry are presented in this paper. Six binary Sn-Zn and fourteen ternary Al-Sn-Zn alloys with 0.6 to 3 wt. % Al were prepared experimentally (melting in the electrical resistance furnace and casting into a graphite mould). The alloys were studied metallographically, the micro-hardness, their overall chemical composition (ICP-AES and OES on the Spectromax device) and X-ray micro-analysis (EDAX, WDX) of the coexisting phases were measured, too. Temperatures of liquidus, solidus and other transformation reactions and latent heats of melting and solidifying were investigated applying the DTA method. Experiments were performed with Setaram SETSYS 18TM experimental laboratory system for thermal analysis. Samples of selected alloys were analysed at linear heating/cooling rate of 4°C/min in the atmosphere of high pure argon. Resulting experimenta (en)
Title
  • Lead-free solders on the tin-zinc-aluminium basis for high temperature applications
  • Lead-free solders on the tin-zinc-aluminium basis for high temperature applications (en)
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  • Lead-free solders on the tin-zinc-aluminium basis for high temperature applications
  • Lead-free solders on the tin-zinc-aluminium basis for high temperature applications (en)
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  • RIV/61989100:27360/09:00022140!RIV10-MSM-27360___
http://linked.open...avai/riv/aktivita
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  • P(OC08053), Z(MSM6198910013)
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
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  • 323385
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  • RIV/61989100:27360/09:00022140
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  • Lead-free solders; tin-zinc-aluminium alloys; properties; phase equilibria (en)
http://linked.open.../riv/klicoveSlovo
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  • [4EA4CE0673E4]
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  • Závažná Poruba
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  • Bratislava
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  • Development of materials science in research and education
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  • Drápala, Jaromír
  • Kroupa, Aleš
  • Smetana, Bedřich
  • Urbánek, J.
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http://linked.open.../riv/zahajeniAkce
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number of pages
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  • Slovenská technická univerzita v Bratislave
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  • 978-80-89088-81-2
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  • 27360
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