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| rdf:type
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| Description
| - Interaction of lead-free solders with copper substrate represents an important phenomenon in the issue of reliability of solder joints. New experimental data describing phase equilibria in the Cu-In-Sn system after long-time diffusion annealing at the 400 °C/50 hours, 600 °C/310 hours and 600 °C/48 hours will be presented. The composition of solders was: 100 % Sn, 75 % Sn + 25 % In, 50 % Sn + 50 % In, 25 % Sn + 75 % In, 100 % In. The fast quenching method was employed to freeze thermodynamic equilibrium after annealing, followed by metallography, micro-hardness measurements, SEM (Scanning Electron Microscope) and WDX (Wave Dispersive X-ray) analysis. New phase equilibrium data, together with the data from literature, represent the best existing experimental description of phase equilibria in the system in question. The obtained experimental results of the phase equilibria were compared with the thermodynamic modelling by the CALPHAD (Calculation of Phase Diagrams) method and with other authors.
- Interaction of lead-free solders with copper substrate represents an important phenomenon in the issue of reliability of solder joints. New experimental data describing phase equilibria in the Cu-In-Sn system after long-time diffusion annealing at the 400 °C/50 hours, 600 °C/310 hours and 600 °C/48 hours will be presented. The composition of solders was: 100 % Sn, 75 % Sn + 25 % In, 50 % Sn + 50 % In, 25 % Sn + 75 % In, 100 % In. The fast quenching method was employed to freeze thermodynamic equilibrium after annealing, followed by metallography, micro-hardness measurements, SEM (Scanning Electron Microscope) and WDX (Wave Dispersive X-ray) analysis. New phase equilibrium data, together with the data from literature, represent the best existing experimental description of phase equilibria in the system in question. The obtained experimental results of the phase equilibria were compared with the thermodynamic modelling by the CALPHAD (Calculation of Phase Diagrams) method and with other authors. (en)
- Interakce bezolovnatých pájek s Cu substrátem představuje důležitý jev v oblasti spolehlivosti pájených spojů. Jsou prezentována nová experimentální data popisující fázové rovnováhy v systému Cu - In - Sn po dlouhodobém difuzním žíhání při 400 °C/50 h, 600 °C/310 h a 600 °C/48 h. Složení pájek bylo: 100 % Sn, 75 % Sn + 25 % In, 50 % Sn + 50 % In, 25 % Sn + 75 % In, 100 % In. Byla použita metoda kalení pro zachování termodynamické rovnováhy po žíhání, následovaná metalografií, měřením mikrotvrdosti, SEM (rastrovací elektronový mikroskop) a WDX (vlnová rozptylovaná rentgenová) analýzou. Nová fázová rovnovážná data, společně s daty z literatury, představují nejlépe existující experimentální popis fázových rovnováh v zmíněném systému. Získané experimentální výsledky fázových rovnováh byly srovnávány s termodynamickým modelováním pomocí metody CALPHAD (výpočet fázových diagramů) i s ostatními autory. (cs)
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| Title
| - Study of Reaction Diffusivity in the Copper - Indium - Tin Ternary System
- Study of Reaction Diffusivity in the Copper - Indium - Tin Ternary System (en)
- Studium reaktivní difuzivity v ternárním sustému měď - indium - cín (cs)
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| skos:prefLabel
| - Study of Reaction Diffusivity in the Copper - Indium - Tin Ternary System
- Study of Reaction Diffusivity in the Copper - Indium - Tin Ternary System (en)
- Studium reaktivní difuzivity v ternárním sustému měď - indium - cín (cs)
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| skos:notation
| - RIV/61989100:27360/07:00014328!RIV08-MSM-27360___
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| http://linked.open.../vavai/riv/strany
| |
| http://linked.open...avai/riv/aktivita
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| http://linked.open...avai/riv/aktivity
| - P(OC 094), Z(MSM6198910013)
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| http://linked.open...vai/riv/dodaniDat
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| http://linked.open...aciTvurceVysledku
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| http://linked.open.../riv/druhVysledku
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| http://linked.open...iv/duvernostUdaju
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| http://linked.open...titaPredkladatele
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| http://linked.open...dnocenehoVysledku
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| http://linked.open...ai/riv/idVysledku
| - RIV/61989100:27360/07:00014328
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| http://linked.open...riv/jazykVysledku
| |
| http://linked.open.../riv/klicovaSlova
| - Reaction diffusivity; copper; indium; tin; ternary system; moving boundary interface; Stefan problem (en)
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| http://linked.open.../riv/klicoveSlovo
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| http://linked.open...ontrolniKodProRIV
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| http://linked.open...i/riv/mistoVydani
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| http://linked.open...i/riv/nazevZdroje
| - Diffusion and Termodynamics of Materials
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| http://linked.open...in/vavai/riv/obor
| |
| http://linked.open...ichTvurcuVysledku
| |
| http://linked.open...cetTvurcuVysledku
| |
| http://linked.open...vavai/riv/projekt
| |
| http://linked.open...UplatneniVysledku
| |
| http://linked.open...iv/tvurceVysledku
| - Drápala, Jaromír
- Kubíček, Petr
- Losertová, Monika
- Vřešťál, V.
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| http://linked.open...n/vavai/riv/zamer
| |
| number of pages
| |
| http://purl.org/ne...btex#hasPublisher
| - Trans Tech Publication Ltd
|
| https://schema.org/isbn
| |
| http://localhost/t...ganizacniJednotka
| |
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