About: Fabrication of plastic microchips with gold microelectrodes using techniques of sacrificed substrate and thermally activated solvent bonding

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About: Fabrication of plastic microchips with gold microelectrodes using techniques of sacrificed substrate and thermally activated solvent bonding Goto Sponge NotDistinct Permalink

An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	A novel fabrication process of polymethyl methacrylate (PMMA) microfluidic chip with embedded gold microelectrodes has been developed. The PMMA chips consist of a microfluidic part, which is made by micro-milling and a mate with embedded gold electrodes made by sacrificed substrate technique. The developed sacrificed substrate technique combines photolithography, gold electrodeposition and embedding of the gold structures into a UV curable resin. Both microfluidic and electrode parts are bonded together by thermally activated solvent bonding. Isopropyl alcohol (IPA) is used as a bonding agent. Using the IPA solvent brings several advantages compared to conventional thermal bonding: (i) decreasing the bonding temperature, (ii) higher bond strength. Decreasing the bonding temperature is crucial for the whole process, because of prevention of electrode cracking, microfluidic channel deformation and clogging. Higher bond strength prevents a liquid leakage and generally improves the microdevice durability. A novel fabrication process of polymethyl methacrylate (PMMA) microfluidic chip with embedded gold microelectrodes has been developed. The PMMA chips consist of a microfluidic part, which is made by micro-milling and a mate with embedded gold electrodes made by sacrificed substrate technique. The developed sacrificed substrate technique combines photolithography, gold electrodeposition and embedding of the gold structures into a UV curable resin. Both microfluidic and electrode parts are bonded together by thermally activated solvent bonding. Isopropyl alcohol (IPA) is used as a bonding agent. Using the IPA solvent brings several advantages compared to conventional thermal bonding: (i) decreasing the bonding temperature, (ii) higher bond strength. Decreasing the bonding temperature is crucial for the whole process, because of prevention of electrode cracking, microfluidic channel deformation and clogging. Higher bond strength prevents a liquid leakage and generally improves the microdevice durability. (en)
Title	Fabrication of plastic microchips with gold microelectrodes using techniques of sacrificed substrate and thermally activated solvent bonding Fabrication of plastic microchips with gold microelectrodes using techniques of sacrificed substrate and thermally activated solvent bonding (en)
skos:prefLabel	Fabrication of plastic microchips with gold microelectrodes using techniques of sacrificed substrate and thermally activated solvent bonding Fabrication of plastic microchips with gold microelectrodes using techniques of sacrificed substrate and thermally activated solvent bonding (en)
skos:notation	RIV/60461373:22340/10:00023212!RIV11-GA0-22340___
http://linked.open...avai/riv/aktivita	P Z
http://linked.open...avai/riv/aktivity	P(GD104/08/H055), P(IAA401280904), Z(MSM6046137306)
http://linked.open...iv/cisloPeriodika	5-8
http://linked.open...vai/riv/dodaniDat	2011
http://linked.open...aciTvurceVysledku	Slouka, Zdeněk Schrott, Walter Přibyl, Michal Šnita, Dalimil Červenka, Petr Svoboda, Miloš
http://linked.open.../riv/druhVysledku	J - Článek v odborném periodiku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoká škola chemicko-technologická v Praze / Fakulta chemicko-inženýrská
http://linked.open...dnocenehoVysledku	258651
http://linked.open...ai/riv/idVysledku	RIV/60461373:22340/10:00023212
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	Micro-electrode; Micro-electrode array; Sacrificed substrate; Solvent bonding (en)
http://linked.open.../riv/klicoveSlovo	Micro-electrode Micro-electrode array Sacrificed substrate Solvent bonding
http://linked.open...odStatuVydavatele	NL - Nizozemsko
http://linked.open...ontrolniKodProRIV	[FA30725DD6A8]
http://linked.open...i/riv/nazevZdroje	Microelectronic Engineering
http://linked.open...in/vavai/riv/obor	CI
http://linked.open...ichTvurcuVysledku	6 (xsd:int)
http://linked.open...cetTvurcuVysledku	6 (xsd:int)
http://linked.open...vavai/riv/projekt	Transport and reaction processes in complex multiphase systems High-aspect-ratio electrochemical processing of metallic microstructures
http://linked.open...UplatneniVysledku	2010
http://linked.open...v/svazekPeriodika	87
http://linked.open...iv/tvurceVysledku	Slouka, Zdeněk Svoboda, Miloš Šnita, Dalimil Přibyl, Michal Schrott, Walter Červenka, Petr
http://linked.open...ain/vavai/riv/wos	000276300700232
http://linked.open...n/vavai/riv/zamer	Reakčně-transportní chemicko-inženýrské systémy a jejich dynamické chování, modelování a řízení chemických a biotechnologických procesů
issn	0167-9317
number of pages	4 (xsd:int)
http://localhost/t...ganizacniJednotka	22340

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