About: Improvement of Ni/Si/4H-SiC ohmic contacts by VLS grown subcontact layer     Goto   Sponge   NotDistinct   Permalink

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  • This work presents results of using VLS epitaxial SiGe-type structure as a sub-contact layer designated for Ni/Si ohmic contacts. The epitaxial growth was performed at 1240 and 1414°C in various types of atmosphere in a processing chamber. The prepared layers had mostly smooth surface. XPS analysis showed that germanium escape from the structure occurred during the process of the epitaxial growth. An important result is that silicon and carbon bind in the form of SiC already at the surface of the structure, which proves silicon carbide formation during the epitaxial growth. Ni/Si-type contact metallization was deposited onto all epitaxial structures. After annealing we received ohmic contacts with contact resistivity equal or lower compared to the standard contact structure Ni/Si/SiC prepared on the same substrate. The best value of contact resistivity was 4x10-5 cm2. The doping concentration in the VLS epitaxial layers is reaching the value (6-7)x1018 cm-3.
  • This work presents results of using VLS epitaxial SiGe-type structure as a sub-contact layer designated for Ni/Si ohmic contacts. The epitaxial growth was performed at 1240 and 1414°C in various types of atmosphere in a processing chamber. The prepared layers had mostly smooth surface. XPS analysis showed that germanium escape from the structure occurred during the process of the epitaxial growth. An important result is that silicon and carbon bind in the form of SiC already at the surface of the structure, which proves silicon carbide formation during the epitaxial growth. Ni/Si-type contact metallization was deposited onto all epitaxial structures. After annealing we received ohmic contacts with contact resistivity equal or lower compared to the standard contact structure Ni/Si/SiC prepared on the same substrate. The best value of contact resistivity was 4x10-5 cm2. The doping concentration in the VLS epitaxial layers is reaching the value (6-7)x1018 cm-3. (en)
Title
  • Improvement of Ni/Si/4H-SiC ohmic contacts by VLS grown subcontact layer
  • Improvement of Ni/Si/4H-SiC ohmic contacts by VLS grown subcontact layer (en)
skos:prefLabel
  • Improvement of Ni/Si/4H-SiC ohmic contacts by VLS grown subcontact layer
  • Improvement of Ni/Si/4H-SiC ohmic contacts by VLS grown subcontact layer (en)
skos:notation
  • RIV/60461373:22310/10:00022999!RIV11-MSM-22310___
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • S, Z(MSM6046137302)
http://linked.open...iv/cisloPeriodika
  • 12
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 263189
http://linked.open...ai/riv/idVysledku
  • RIV/60461373:22310/10:00022999
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • VLS epitaxy; ohmic contact; Silicon carbide; nickel (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...odStatuVydavatele
  • NL - Nizozemsko
http://linked.open...ontrolniKodProRIV
  • [DFB167FDD62E]
http://linked.open...i/riv/nazevZdroje
  • Microelectronic Engineering
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...UplatneniVysledku
http://linked.open...v/svazekPeriodika
  • 87
http://linked.open...iv/tvurceVysledku
  • Barda, Bohumil
  • Machač, Petr
http://linked.open...ain/vavai/riv/wos
  • 000282206100009
http://linked.open...n/vavai/riv/zamer
issn
  • 0167-9317
number of pages
http://localhost/t...ganizacniJednotka
  • 22310
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