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Description
  • The sputtering and evaporation of solid materials are fundamental physical processes currently used in the physical vapor deposition (PVD)of thin films. Up to the mind-1970s, however, the evaporation dominated over the sputtering in PVD technologies. This way mainly due to a very low sputter deposition rate of the film and relatively high pressures needed to sustain the sputtering discharge. The breakthrough arrived in 1974 when the planar magnetron was discovered by Chapin. From this moment, a very strong development of the sputtering method starting.
  • The sputtering and evaporation of solid materials are fundamental physical processes currently used in the physical vapor deposition (PVD)of thin films. Up to the mind-1970s, however, the evaporation dominated over the sputtering in PVD technologies. This way mainly due to a very low sputter deposition rate of the film and relatively high pressures needed to sustain the sputtering discharge. The breakthrough arrived in 1974 when the planar magnetron was discovered by Chapin. From this moment, a very strong development of the sputtering method starting. (en)
  • Kapitola z knihy přináší ucelený přehled magnetronových systémů používaných v oblasti naprašování tenkých vrstev, jejich vývoj a srovnání jejich základních charakteristických vlastností. Speciální pozornost je dále věnována problematice reaktivního magnetronového naprašování a vlivu energie částic na proces růstu vrstev. (cs)
Title
  • Magnetron discharges for thin films plasma processing
  • Magnetron discharges for thin films plasma processing (en)
  • Magnetronové výboje v procesu vytváření tenkých vrstev (cs)
skos:prefLabel
  • Magnetron discharges for thin films plasma processing
  • Magnetron discharges for thin films plasma processing (en)
  • Magnetronové výboje v procesu vytváření tenkých vrstev (cs)
skos:notation
  • RIV/49777513:23520/06:00000242!RIV07-MSM-23520___
http://linked.open.../vavai/riv/strany
  • 67-106
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • Z(MSM 235200002)
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 483911
http://linked.open...ai/riv/idVysledku
  • RIV/49777513:23520/06:00000242
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  • magnetron discharge; sputtering sources; sputtering process; thin films formation; energy effect (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [B7B3D6AA5BDE]
http://linked.open...i/riv/mistoVydani
  • Oxford, Velká Británie
http://linked.open...i/riv/nazevZdroje
  • Materials surface processing by directed energy techniques
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...UplatneniVysledku
http://linked.open...iv/tvurceVysledku
  • Musil, Jindřich
  • Vlček, Jaroslav
  • Baroch, Pavel
http://linked.open...n/vavai/riv/zamer
number of pages
http://purl.org/ne...btex#hasPublisher
  • Elsevier
https://schema.org/isbn
  • 0-08-044496-2
http://localhost/t...ganizacniJednotka
  • 23520
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