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  • This paper investigates the effects of reflow time and reflow peak temperature on the mechanical strength and the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC) soldered joints. The input variables are the peak temperature and the duration of peak time. The peak temperature has two levels, 235 and 250°C. The time of peak temperature has two levels, 20 and 50s. The IMC thickness increases with higher reflow peak temperature and longer time above liquidus.
  • This paper investigates the effects of reflow time and reflow peak temperature on the mechanical strength and the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC) soldered joints. The input variables are the peak temperature and the duration of peak time. The peak temperature has two levels, 235 and 250°C. The time of peak temperature has two levels, 20 and 50s. The IMC thickness increases with higher reflow peak temperature and longer time above liquidus. (en)
  • This paper investigates the effects of reflow time and reflow peak temperature on the mechanical strength and the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC) soldered joints. The input variables are the peak temperature and the duration of peak time. The peak temperature has two levels, 235 and 250°C. The time of peak temperature has two levels, 20 and 50s. The IMC thickness increases with higher reflow peak temperature and longer time above liquidus. (cs)
Title
  • Influence of Reflow Profile to Solder Joint Mechanical Strength (en)
  • Vliv pájecího profilu na mechanickou pevnost pájeného spoje
  • Vliv pájecího profilu na mechanickou pevnost pájeného spoje (cs)
skos:prefLabel
  • Influence of Reflow Profile to Solder Joint Mechanical Strength (en)
  • Vliv pájecího profilu na mechanickou pevnost pájeného spoje
  • Vliv pájecího profilu na mechanickou pevnost pájeného spoje (cs)
skos:notation
  • RIV/49777513:23220/13:43919752!RIV14-MSM-23220___
http://linked.open...avai/riv/aktivita
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  • 114572
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  • RIV/49777513:23220/13:43919752
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  • Intermetallic compound; Soldering; Reflow profile (en)
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http://linked.open...ontrolniKodProRIV
  • [DFAD1ED8C55F]
http://linked.open...in/vavai/riv/obor
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  • Wirth, Václav
http://localhost/t...ganizacniJednotka
  • 23220
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