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  • The article will present the results of the measured values from solderability testing of printed circuit boards. The aim of this paper is to compare different atmosphere for solderability testing with different finishes of printed circuit boards (PCB's). The article contains a description of the methods used for solderability testing of printed circuit boards. The method of wetting balance test was chosen for this experiment. The PCB can be made with several kinds of surface finishing. Copper is the most commonly used material in the manufacture of printed circuit boards. The negative property of copper is its low chemical stability. When a contact is in an atmosphere that contains oxygen, the surface is covered with a layer of copper oxides. This layer deteriorates copper solderability. Another way how to prevent oxidation of copper soldering pads of printed circuit boards is an inert atmosphere. As an inert atmosphere not contains oxygen prevents oxidation of the material used on PCB's. The increasingly frequent introduction of inert atmosphere into soldering processes encourages the introduction of inert atmosphere also into solderability testing processes.
  • The article will present the results of the measured values from solderability testing of printed circuit boards. The aim of this paper is to compare different atmosphere for solderability testing with different finishes of printed circuit boards (PCB's). The article contains a description of the methods used for solderability testing of printed circuit boards. The method of wetting balance test was chosen for this experiment. The PCB can be made with several kinds of surface finishing. Copper is the most commonly used material in the manufacture of printed circuit boards. The negative property of copper is its low chemical stability. When a contact is in an atmosphere that contains oxygen, the surface is covered with a layer of copper oxides. This layer deteriorates copper solderability. Another way how to prevent oxidation of copper soldering pads of printed circuit boards is an inert atmosphere. As an inert atmosphere not contains oxygen prevents oxidation of the material used on PCB's. The increasingly frequent introduction of inert atmosphere into soldering processes encourages the introduction of inert atmosphere also into solderability testing processes. (en)
Title
  • Usage of inert atmosphere for solderability testing
  • Usage of inert atmosphere for solderability testing (en)
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  • Usage of inert atmosphere for solderability testing
  • Usage of inert atmosphere for solderability testing (en)
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  • RIV/49777513:23220/12:43915621!RIV13-MSM-23220___
http://linked.open...avai/riv/aktivita
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  • P(ED2.1.00/03.0094), S
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  • 176279
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  • RIV/49777513:23220/12:43915621
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  • wetting balance test; nitrogen; inert atmosphere; Solderability (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [1CBE8C2C89C2]
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  • Novák, Tomáš
  • Steiner, František
  • Machač, Jan
http://localhost/t...ganizacniJednotka
  • 23220
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