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| rdf:type
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| Description
| - This paper presents the results of solderability testing of printed circuit boards. The aim of this paper is to compare different methods of solderability testing with different finishes of PCB?s. Recommendation of solderability test methods suitable for the technological processes of soldering is mentioned at the end. The article contains a detailed description of the methods used for solderability testing of printed circuit boards. The most commonly used methods include the method of wetting balance test, area of spread test, dip and look test, meniscus rise method, and rotary dip method. Solderability testing can determine how much is the material suitable for industrial soldering. The mass production of electronic devices uses several soldering technologies. These technologies can be divided into two basic groups. The first group is wave soldering and the second group is reflow soldering. Reflow soldering can be further divided according to the source of heat required to reflow the solder alloy. Due to differences in soldering technologies, some solderability tests are more suitable for wave soldering, another for reflow soldering. The method of wetting balance test consists of dipping the test samples in a bath of molten solder. This is the main reason why this method of solderability testing is used for materials that will be soldered using wave soldering. In contrast, for example area of spread test is suitable for testing the solderability of materials soldered using reflow soldering technologies. Area of spread test is also suitable for testing and comparing of flux activity.
- This paper presents the results of solderability testing of printed circuit boards. The aim of this paper is to compare different methods of solderability testing with different finishes of PCB?s. Recommendation of solderability test methods suitable for the technological processes of soldering is mentioned at the end. The article contains a detailed description of the methods used for solderability testing of printed circuit boards. The most commonly used methods include the method of wetting balance test, area of spread test, dip and look test, meniscus rise method, and rotary dip method. Solderability testing can determine how much is the material suitable for industrial soldering. The mass production of electronic devices uses several soldering technologies. These technologies can be divided into two basic groups. The first group is wave soldering and the second group is reflow soldering. Reflow soldering can be further divided according to the source of heat required to reflow the solder alloy. Due to differences in soldering technologies, some solderability tests are more suitable for wave soldering, another for reflow soldering. The method of wetting balance test consists of dipping the test samples in a bath of molten solder. This is the main reason why this method of solderability testing is used for materials that will be soldered using wave soldering. In contrast, for example area of spread test is suitable for testing the solderability of materials soldered using reflow soldering technologies. Area of spread test is also suitable for testing and comparing of flux activity. (en)
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| Title
| - Comparison of solderability testing methods of PCBS with different surface finishes
- Comparison of solderability testing methods of PCBS with different surface finishes (en)
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| skos:prefLabel
| - Comparison of solderability testing methods of PCBS with different surface finishes
- Comparison of solderability testing methods of PCBS with different surface finishes (en)
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| skos:notation
| - RIV/49777513:23220/11:43899151!RIV12-MSM-23220___
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| http://linked.open...avai/riv/aktivita
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| http://linked.open...avai/riv/aktivity
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| http://linked.open...vai/riv/dodaniDat
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| http://linked.open...aciTvurceVysledku
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| http://linked.open.../riv/druhVysledku
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| http://linked.open...iv/duvernostUdaju
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| http://linked.open...titaPredkladatele
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| http://linked.open...dnocenehoVysledku
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| http://linked.open...ai/riv/idVysledku
| - RIV/49777513:23220/11:43899151
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| http://linked.open...riv/jazykVysledku
| |
| http://linked.open.../riv/klicovaSlova
| - Solderability, solderability testing, surface finishes, lead-free solder (en)
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| http://linked.open.../riv/klicoveSlovo
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| http://linked.open...ontrolniKodProRIV
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| http://linked.open...v/mistoKonaniAkce
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| http://linked.open...i/riv/mistoVydani
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| http://linked.open...i/riv/nazevZdroje
| - Electronic devices and systems : IMAPS CS international conference : proceedings
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| http://linked.open...in/vavai/riv/obor
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| http://linked.open...ichTvurcuVysledku
| |
| http://linked.open...cetTvurcuVysledku
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| http://linked.open...UplatneniVysledku
| |
| http://linked.open...iv/tvurceVysledku
| - Hujer, Tomáš
- Novák, Tomáš
- Rendl, Karel
- Steiner, František
- Wirth, Václav
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| http://linked.open...vavai/riv/typAkce
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| http://linked.open.../riv/zahajeniAkce
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| http://linked.open...n/vavai/riv/zamer
| |
| number of pages
| |
| http://purl.org/ne...btex#hasPublisher
| - Vysoké učení technické v Brně
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| https://schema.org/isbn
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| http://localhost/t...ganizacniJednotka
| |
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