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Description
  • Příspěvek se zabývá otázkou hledání optimálních vytvrzovacích charakteristik kompozitních izolačních materiálů s epoxidovým pojivem s ohledem na finální elektrické vlastnosti. (cs)
  • There is difficult to imagine modern production of electrical devices without components containing organic substances. This fact is mainly concerned to composite materials, in which the bond component is made of organic substance. The intricate curing reactions have been proceeding during the composites technological curing as well as during the device operation, where mostly the thermal-oxidative reactions, leading to material degradation, occur. For above-mentioned reasons, there is given big attention to the study of the reactions proceeding in the material.
  • There is difficult to imagine modern production of electrical devices without components containing organic substances. This fact is mainly concerned to composite materials, in which the bond component is made of organic substance. The intricate curing reactions have been proceeding during the composites technological curing as well as during the device operation, where mostly the thermal-oxidative reactions, leading to material degradation, occur. For above-mentioned reasons, there is given big attention to the study of the reactions proceeding in the material. (en)
Title
  • Optimalization of the thermal curing of epoxy based insulation
  • Optimalization of the thermal curing of epoxy based insulation (en)
  • Optimalizace vytvrzovacích procesů izolací na bázi epoxidů (cs)
skos:prefLabel
  • Optimalization of the thermal curing of epoxy based insulation
  • Optimalization of the thermal curing of epoxy based insulation (en)
  • Optimalizace vytvrzovacích procesů izolací na bázi epoxidů (cs)
skos:notation
  • RIV/49777513:23220/08:00500449!RIV09-MSM-23220___
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • Z(MSM4977751310)
http://linked.open...iv/cisloPeriodika
  • 2
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 385167
http://linked.open...ai/riv/idVysledku
  • RIV/49777513:23220/08:00500449
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • curing; epoxy resin; permittivity; loss factor (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...odStatuVydavatele
  • SK - Slovenská republika
http://linked.open...ontrolniKodProRIV
  • [7837A31C95C6]
http://linked.open...i/riv/nazevZdroje
  • Acta Electrotechnica et Informatica
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...UplatneniVysledku
http://linked.open...v/svazekPeriodika
  • 8
http://linked.open...iv/tvurceVysledku
  • Mentlík, Václav
  • Pihera, Josef
  • Trnka, Pavel
http://linked.open...n/vavai/riv/zamer
issn
  • 1335-8243
number of pages
http://localhost/t...ganizacniJednotka
  • 23220
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