About: Experimental study of glass frit bonding

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	Glass frit bonding technology provides a wide range of possibilities for the bonding of wafers at process temperatures below 450 C. The process consists of three main steps: screen-printing of the glass paste, thermal conditioning and thermo-compressive bonding. The structured bonding layer protects moveable structures from parasitic bonding. Almost all surface layers commonly used in silicon micromachining can be bonded using glass frits. The main advantages of glass frit bonding are hermetic sealing, high process yield, low mechanical stress at the bonding interface, high bonding strength, and good reliability. Glass frit bonding technology provides a wide range of possibilities for the bonding of wafers at process temperatures below 450 C. The process consists of three main steps: screen-printing of the glass paste, thermal conditioning and thermo-compressive bonding. The structured bonding layer protects moveable structures from parasitic bonding. Almost all surface layers commonly used in silicon micromachining can be bonded using glass frits. The main advantages of glass frit bonding are hermetic sealing, high process yield, low mechanical stress at the bonding interface, high bonding strength, and good reliability. (en)
Title	Experimental study of glass frit bonding Experimental study of glass frit bonding (en)
skos:prefLabel	Experimental study of glass frit bonding Experimental study of glass frit bonding (en)
skos:notation	RIV/00216305:26620/12:PU98794!RIV13-GA0-26620___
http://linked.open...avai/riv/aktivita	P S
http://linked.open...avai/riv/aktivity	P(GA102/09/1601), P(GAP205/10/1374), S
http://linked.open...vai/riv/dodaniDat	2013
http://linked.open...aciTvurceVysledku	Chomoucká, Jana Prášek, Jan Pekárek, Jan Vrba, Radimír
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Středoevropský technologický institut
http://linked.open...dnocenehoVysledku	135633
http://linked.open...ai/riv/idVysledku	RIV/00216305:26620/12:PU98794
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	Glass frit, wafer bonding (en)
http://linked.open.../riv/klicoveSlovo	Glass frit wafer bonding
http://linked.open...ontrolniKodProRIV	[FCF6F2EEB32F]
http://linked.open...v/mistoKonaniAkce	Brno
http://linked.open...i/riv/mistoVydani	Brno
http://linked.open...i/riv/nazevZdroje	XII. Pracovní setkání fyzikálních chemiků a elektrochemiků
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	4 (xsd:int)
http://linked.open...cetTvurcuVysledku	4 (xsd:int)
http://linked.open...vavai/riv/projekt	Intelligent micro and nano structures for microsensors realized with support of nanotechnology Plasmachemical processes for synthesis of carbon nanotubes and study of their functional properties
http://linked.open...UplatneniVysledku	2012
http://linked.open...iv/tvurceVysledku	Chomoucká, Jana Pekárek, Jan Prášek, Jan Vrba, Radimír
http://linked.open...vavai/riv/typAkce	CST - Celostátní
http://linked.open.../riv/zahajeniAkce	2012-05-30 (xsd:date)
number of pages	2 (xsd:int)
http://purl.org/ne...btex#hasPublisher	Mendelova zemědělská a lesnická univerzita v Brně
https://schema.org/isbn	978-80-7375-618-5
http://localhost/t...ganizacniJednotka	26620

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