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  • Plasma polymer films in the form of hydrogenated amorphous carbon-silicon (a-SiC:H) or carbon-silicon oxide (a-SiOC:H) alloy are often used as barrier or protective layers for polymer and metal substrates, cutting tools, electronic, and optoelectronic devices. Properties of the devices are influenced by interfacial phenomena. To eliminate or at least reduce the internal stresses and improve adhesion, mostly multilayered rather than a single layer film has to be used. Such multilayers may be used for passivation of organic devices, as a dielectric barrier in semiconductor devices, as tribological coatings in aeronautical applications, or as a functional coating in polymer composites with controlled interphase.
  • Plasma polymer films in the form of hydrogenated amorphous carbon-silicon (a-SiC:H) or carbon-silicon oxide (a-SiOC:H) alloy are often used as barrier or protective layers for polymer and metal substrates, cutting tools, electronic, and optoelectronic devices. Properties of the devices are influenced by interfacial phenomena. To eliminate or at least reduce the internal stresses and improve adhesion, mostly multilayered rather than a single layer film has to be used. Such multilayers may be used for passivation of organic devices, as a dielectric barrier in semiconductor devices, as tribological coatings in aeronautical applications, or as a functional coating in polymer composites with controlled interphase. (en)
Title
  • Multilayered and Functionally Gradient Thin Films of Plasma Polymers
  • Multilayered and Functionally Gradient Thin Films of Plasma Polymers (en)
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  • Multilayered and Functionally Gradient Thin Films of Plasma Polymers
  • Multilayered and Functionally Gradient Thin Films of Plasma Polymers (en)
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  • RIV/00216305:26310/10:PU90077!RIV11-MSM-26310___
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  • RIV/00216305:26310/10:PU90077
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  • plasma polymerization, thin films (en)
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  • Čech, Vladimír
  • Hoferek, Lukáš
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  • 26310
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