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  • This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.
  • This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering. (en)
  • This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering. (cs)
Title
  • Impact of solder paste drying on the solderability
  • Impact of solder paste drying on the solderability (en)
  • Impact of solder paste drying on the solderability (cs)
skos:prefLabel
  • Impact of solder paste drying on the solderability
  • Impact of solder paste drying on the solderability (en)
  • Impact of solder paste drying on the solderability (cs)
skos:notation
  • RIV/00216305:26220/14:PU110595!RIV15-MSM-26220___
http://linked.open...avai/riv/aktivita
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  • S
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  • 20719
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  • RIV/00216305:26220/14:PU110595
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  • copper alloys, drying, reflow soldering, silver alloys, solders, tin alloys (en)
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  • [24F210AF2086]
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  • Dresden
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  • Dresden
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  • 37th Int. Spring Seminar on Electronics Technology
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  • Szendiuch, Ivan
  • Adámek, Martin
  • Otáhal, Alexandr
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number of pages
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  • 10.1109/ISSE.2014.6887592
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  • IEEE
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  • 978-1-4799-4455-2
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  • 26220
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