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  • This paper deals with the use of the computer simulation for semiconductor chip attach investigation, where the wire bonding is the mostly used process. The main focus lays on the correct definition of the capillary trace, which is essential for creation of a good bond contact as for chip, as well for package or substrate pad. Several simulations for different shapes of loops were created and compared with real bonds, which were done based on the settings from the analysis.
  • This paper deals with the use of the computer simulation for semiconductor chip attach investigation, where the wire bonding is the mostly used process. The main focus lays on the correct definition of the capillary trace, which is essential for creation of a good bond contact as for chip, as well for package or substrate pad. Several simulations for different shapes of loops were created and compared with real bonds, which were done based on the settings from the analysis. (en)
  • This paper deals with the use of the computer simulation for semiconductor chip attach investigation, where the wire bonding is the mostly used process. The main focus lays on the correct definition of the capillary trace, which is essential for creation of a good bond contact as for chip, as well for package or substrate pad. Several simulations for different shapes of loops were created and compared with real bonds, which were done based on the settings from the analysis. (cs)
Title
  • The Use of Computer Simulation in the Electronic Packaging Process
  • The Use of Computer Simulation in the Electronic Packaging Process (en)
  • The Use of Computer Simulation in the Electronic Packaging Process (cs)
skos:prefLabel
  • The Use of Computer Simulation in the Electronic Packaging Process
  • The Use of Computer Simulation in the Electronic Packaging Process (en)
  • The Use of Computer Simulation in the Electronic Packaging Process (cs)
skos:notation
  • RIV/00216305:26220/13:PU106919!RIV14-MSM-26220___
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • S
http://linked.open...iv/cisloPeriodika
  • 592-593
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 112954
http://linked.open...ai/riv/idVysledku
  • RIV/00216305:26220/13:PU106919
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • ANSYS Workbench, Chip Connection, Simulation, Wirebonding (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...odStatuVydavatele
  • CH - Švýcarská konfederace
http://linked.open...ontrolniKodProRIV
  • [44820574FAED]
http://linked.open...i/riv/nazevZdroje
  • Key Engineering Materials (print)
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...UplatneniVysledku
http://linked.open...v/svazekPeriodika
  • 2014
http://linked.open...iv/tvurceVysledku
  • Szendiuch, Ivan
  • Buršík, Martin
  • Psota, Boleslav
issn
  • 1013-9826
number of pages
http://bibframe.org/vocab/doi
  • 10.4028/www.scientific.net/KEM.592-593.201
http://localhost/t...ganizacniJednotka
  • 26220
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