About: Investigation of the Mechanical Properties of Lead-Free Solder Materials

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

Attributes	Values
rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
rdfs:seeAlso	http://www.scientific.net/KEM.592-593.453
Description	Reliability and life-time of electric/electronic products is still a highly actual and discussed topic. Every electric/electronic product is heterogeneous system which consists not only from components and constructional parts, but also from many interconnections. Basic segments of interconnection are solder joints, actually created by lead-free materials. The passing from well-proven lead solders to lead free compositions brought many new aspects in reliability and life-time of electronic systems. Some of the negative factors are their poor electro-mechanical properties, which are based on complicated microstructure of interlayer interface. This fact causes defects in solder joints and consequential failure of the function. This article is focused on an investigation of mechanical properties by lead-free solder joints. There are investigated various properties of common lead free solder paste depending on various concentrations of O2 by reflow process. Next, there are shown microstructures by micro Reliability and life-time of electric/electronic products is still a highly actual and discussed topic. Every electric/electronic product is heterogeneous system which consists not only from components and constructional parts, but also from many interconnections. Basic segments of interconnection are solder joints, actually created by lead-free materials. The passing from well-proven lead solders to lead free compositions brought many new aspects in reliability and life-time of electronic systems. Some of the negative factors are their poor electro-mechanical properties, which are based on complicated microstructure of interlayer interface. This fact causes defects in solder joints and consequential failure of the function. This article is focused on an investigation of mechanical properties by lead-free solder joints. There are investigated various properties of common lead free solder paste depending on various concentrations of O2 by reflow process. Next, there are shown microstructures by micro (en)
Title	Investigation of the Mechanical Properties of Lead-Free Solder Materials Investigation of the Mechanical Properties of Lead-Free Solder Materials (en)
skos:prefLabel	Investigation of the Mechanical Properties of Lead-Free Solder Materials Investigation of the Mechanical Properties of Lead-Free Solder Materials (en)
skos:notation	RIV/00216305:26220/13:PU106903!RIV14-MSM-26220___
http://linked.open...avai/riv/aktivita	S
http://linked.open...avai/riv/aktivity	S
http://linked.open...iv/cisloPeriodika	592-593
http://linked.open...vai/riv/dodaniDat	2014
http://linked.open...aciTvurceVysledku	Jansa, Vojtěch Szendiuch, Ivan Otáhal, Alexandr Adámek, Martin
http://linked.open.../riv/druhVysledku	J - Článek v odborném periodiku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	81138
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/13:PU106903
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	Soldering, lead-free solder paste, nitrogen atmosphere, shear test. (en)
http://linked.open.../riv/klicoveSlovo	nitrogen atmosphere lead-free solder paste shear test. Soldering
http://linked.open...odStatuVydavatele	CH - Švýcarská konfederace
http://linked.open...ontrolniKodProRIV	[A132860459CD]
http://linked.open...i/riv/nazevZdroje	Key Engineering Materials (web)
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	4 (xsd:int)
http://linked.open...cetTvurcuVysledku	4 (xsd:int)
http://linked.open...UplatneniVysledku	2013
http://linked.open...v/svazekPeriodika	2013
http://linked.open...iv/tvurceVysledku	Szendiuch, Ivan Adámek, Martin Otáhal, Alexandr Jansa, Vojtěch
issn	1662-9795
number of pages	4 (xsd:int)
http://bibframe.org/vocab/doi	10.4028/www.scientific.net/KEM.592-593.453
http://localhost/t...ganizacniJednotka	26220

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