About: Connection of Electronic and Microelectronic Modules

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

Attributes	Values
rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	Design electronic and microelectronic modules, owerlook of actual connection, new connections (connection with chip components) Design electronic and microelectronic modules, owerlook of actual connection, new connections (connection with chip components) (en)
Title	Connection of Electronic and Microelectronic Modules Connection of Electronic and Microelectronic Modules (en)
skos:prefLabel	Connection of Electronic and Microelectronic Modules Connection of Electronic and Microelectronic Modules (en)
skos:notation	RIV/00216305:26220/13:PU106739!RIV14-MSM-26220___
http://linked.open...avai/riv/aktivita	S
http://linked.open...avai/riv/aktivity	S
http://linked.open...vai/riv/dodaniDat	2014
http://linked.open...aciTvurceVysledku	Šandera, Josef
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	66738
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/13:PU106739
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	electronic module, thermomechanical reliability, flexible connection, rigid connection, connection with chip component (en)
http://linked.open.../riv/klicoveSlovo	connection with chip component electronic module flexible connection rigid connection thermomechanical reliability
http://linked.open...ontrolniKodProRIV	[508C46A375BA]
http://linked.open...v/mistoKonaniAkce	Krakow
http://linked.open...i/riv/mistoVydani	Krakow
http://linked.open...i/riv/nazevZdroje	Proceedings of 37th International Microelectronic and Packaging IMAPS-CPMT Poland Conference, 22-25 September 2013, Krakow, Poland
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	1 (xsd:int)
http://linked.open...cetTvurcuVysledku	1 (xsd:int)
http://linked.open...UplatneniVysledku	2013
http://linked.open...iv/tvurceVysledku	Šandera, Josef
http://linked.open...vavai/riv/typAkce	EUR - Evropská
http://linked.open.../riv/zahajeniAkce	2013-09-22 (xsd:date)
number of pages	5 (xsd:int)
http://purl.org/ne...btex#hasPublisher	IMAPS Poland Chapter
https://schema.org/isbn	978-83-932464-1-0
http://localhost/t...ganizacniJednotka	26220

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