About: Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate

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About: Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate Goto Sponge NotDistinct Permalink

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	The article is focused on usage of the through-hole technology (THT) devices on low-temperature co-fired ceramic (LTCC) substrate. This usage is not common, therefore the main aim of this work is finding out the compatibility between LTCC substrate and a structure of device's lead, solder and thick-film paste. Two arrangements of through-hole metallization were used - printing and hole-filling. The most important results are establishment of reliable assembly process and thermal stress strength for finding the possibility of high temperature application. This is found out by ANSYS software simulation and temperature cycling. Defects caused by temperature cycling were studied optically using micro-cuts. The article is focused on usage of the through-hole technology (THT) devices on low-temperature co-fired ceramic (LTCC) substrate. This usage is not common, therefore the main aim of this work is finding out the compatibility between LTCC substrate and a structure of device's lead, solder and thick-film paste. Two arrangements of through-hole metallization were used - printing and hole-filling. The most important results are establishment of reliable assembly process and thermal stress strength for finding the possibility of high temperature application. This is found out by ANSYS software simulation and temperature cycling. Defects caused by temperature cycling were studied optically using micro-cuts. (en)
Title	Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate (en)
skos:prefLabel	Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate (en)
skos:notation	RIV/00216305:26220/13:PU105873!RIV14-MSM-26220___
http://linked.open...avai/riv/aktivita	S
http://linked.open...avai/riv/aktivity	S
http://linked.open...iv/cisloPeriodika	2013
http://linked.open...vai/riv/dodaniDat	2014
http://linked.open...aciTvurceVysledku	Psota, Boleslav Szendiuch, Ivan Klíma, Martin
http://linked.open.../riv/druhVysledku	J - Článek v odborném periodiku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	66391
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/13:PU105873
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	LTCC, THT, device, joint, reliability. (en)
http://linked.open.../riv/klicoveSlovo	device joint LTCC reliability. THT
http://linked.open...odStatuVydavatele	SK - Slovenská republika
http://linked.open...ontrolniKodProRIV	[D0B171108AF1]
http://linked.open...i/riv/nazevZdroje	Electronics Technology (ISSE), 2011 34th International Spring Seminar on Electronics
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	3 (xsd:int)
http://linked.open...cetTvurcuVysledku	3 (xsd:int)
http://linked.open...UplatneniVysledku	2013
http://linked.open...v/svazekPeriodika	36
http://linked.open...iv/tvurceVysledku	Szendiuch, Ivan Psota, Boleslav Klíma, Martin
issn	2161-2528
number of pages	5 (xsd:int)
http://bibframe.org/vocab/doi	10.1109/ISSE.2013.6648228
http://localhost/t...ganizacniJednotka	26220

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