About: Zero Shrink LTCC 3D Structure Interconnections

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	This paper describes design, construction and some recent tests of three dimensional stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC). These structures have a great potential to create compact structure combining multiple different modules in one package. Internal connections used in these 3D structures have an important role, because they not only provide electrical and signal connection, but they also present mechanical attachment between connected substrates. Goal of this work is to develop, simulate and evaluate new structures based on interesting zero shrink Heraeus HL2000 LTCC substrates, where dimples help to reduce thermo-mechanical stress and pads modified with copper to reduce problems with leaching. This paper describes design, construction and some recent tests of three dimensional stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC). These structures have a great potential to create compact structure combining multiple different modules in one package. Internal connections used in these 3D structures have an important role, because they not only provide electrical and signal connection, but they also present mechanical attachment between connected substrates. Goal of this work is to develop, simulate and evaluate new structures based on interesting zero shrink Heraeus HL2000 LTCC substrates, where dimples help to reduce thermo-mechanical stress and pads modified with copper to reduce problems with leaching. (en)
Title	Zero Shrink LTCC 3D Structure Interconnections Zero Shrink LTCC 3D Structure Interconnections (en)
skos:prefLabel	Zero Shrink LTCC 3D Structure Interconnections Zero Shrink LTCC 3D Structure Interconnections (en)
skos:notation	RIV/00216305:26220/12:PU99452!RIV13-MSM-26220___
http://linked.open...avai/riv/aktivita	P S
http://linked.open...avai/riv/aktivity	P(ED1.1.00/02.0068), S
http://linked.open...vai/riv/dodaniDat	2013
http://linked.open...aciTvurceVysledku	Psota, Boleslav Nicák, Michal Šandera, Josef
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	182279
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/12:PU99452
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	LTCC, soldering, leaching, structure, interconnection (en)
http://linked.open.../riv/klicoveSlovo	soldering structure interconnection LTCC leaching
http://linked.open...ontrolniKodProRIV	[6CAEDECB72E6]
http://linked.open...v/mistoKonaniAkce	Bad Aussee
http://linked.open...i/riv/mistoVydani	Vienna University of Technology Gusshausstrasse
http://linked.open...i/riv/nazevZdroje	2012 35th International Spring Seminar on Electronics Technology (ISSE)
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	3 (xsd:int)
http://linked.open...cetTvurcuVysledku	5 (xsd:int)
http://linked.open...vavai/riv/projekt	Central european institute of technology
http://linked.open...UplatneniVysledku	2012
http://linked.open...iv/tvurceVysledku	Kosina, Petr Starý, Jiří Psota, Boleslav Nicák, Michal Šandera, Josef
http://linked.open...vavai/riv/typAkce	EUR - Evropská
http://linked.open.../riv/zahajeniAkce	2012-05-09 (xsd:date)
number of pages	4 (xsd:int)
http://purl.org/ne...btex#hasPublisher	IEEE Xplore digital library
https://schema.org/isbn	978-1-4673-2241-6
http://localhost/t...ganizacniJednotka	26220

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