About: Effect of nitrogen atmosphere on the soldering process for different types of lead-free solders

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About: Effect of nitrogen atmosphere on the soldering process for different types of lead-free solders Goto Sponge NotDistinct Permalink

An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

Attributes	Values
rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
rdfs:seeAlso	http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6273139
Description	An important part of the microelectronics manufacturing is the reflow process. Even though that the soldering have a long history, the process is still not completely described. Particular still discussed the introduction of the WEEE Directive 2003/108/EC standards and RoHS Directive 2002/95/EC got the soldering received into new areas. There is a space for new material compositions which do not contain lead. Furthermore, a new procedure process, adjusting of equipment and began to make greater use of nitrogen as protective gas. The aim is to compare the already proven commercial solder alloys on different carrier and evaluate more exactly the benefits of nitrogen atmosphere. The evaluation was performed for solder SAC, Sn100C and SnPb solder paste was used as reference. Type of substrates was printed circuit board FR-4 and ceramic substrate. Soldering conducted in atmosphere with different residual oxygen. Results of this paper may serve to increase the quality of soldering classical package as well An important part of the microelectronics manufacturing is the reflow process. Even though that the soldering have a long history, the process is still not completely described. Particular still discussed the introduction of the WEEE Directive 2003/108/EC standards and RoHS Directive 2002/95/EC got the soldering received into new areas. There is a space for new material compositions which do not contain lead. Furthermore, a new procedure process, adjusting of equipment and began to make greater use of nitrogen as protective gas. The aim is to compare the already proven commercial solder alloys on different carrier and evaluate more exactly the benefits of nitrogen atmosphere. The evaluation was performed for solder SAC, Sn100C and SnPb solder paste was used as reference. Type of substrates was printed circuit board FR-4 and ceramic substrate. Soldering conducted in atmosphere with different residual oxygen. Results of this paper may serve to increase the quality of soldering classical package as well (en)
Title	Effect of nitrogen atmosphere on the soldering process for different types of lead-free solders Effect of nitrogen atmosphere on the soldering process for different types of lead-free solders (en)
skos:prefLabel	Effect of nitrogen atmosphere on the soldering process for different types of lead-free solders Effect of nitrogen atmosphere on the soldering process for different types of lead-free solders (en)
skos:notation	RIV/00216305:26220/12:PU98701!RIV13-MSM-26220___
http://linked.open...avai/riv/aktivita	S
http://linked.open...avai/riv/aktivity	S
http://linked.open...vai/riv/dodaniDat	2013
http://linked.open...aciTvurceVysledku	Szendiuch, Ivan Adámek, Martin
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	133172
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/12:PU98701
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	soldering, lead-free, nitrogen (en)
http://linked.open.../riv/klicoveSlovo	lead-free soldering nitrogen
http://linked.open...ontrolniKodProRIV	[59F635F57863]
http://linked.open...v/mistoKonaniAkce	Bad Aussee
http://linked.open...i/riv/mistoVydani	Gusshausstrasse 27- 29, A-1040 WIEN - Austria: I
http://linked.open...i/riv/nazevZdroje	35th International Spring Seminar on Electronics Technology - ISSE 2012 Proceedings
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	2 (xsd:int)
http://linked.open...cetTvurcuVysledku	3 (xsd:int)
http://linked.open...UplatneniVysledku	2012
http://linked.open...iv/tvurceVysledku	Szendiuch, Ivan Adámek, Martin Schnederle, Petr
http://linked.open...vavai/riv/typAkce	EUR - Evropská
http://linked.open.../riv/zahajeniAkce	2012-05-09 (xsd:date)
number of pages	5 (xsd:int)
http://purl.org/ne...btex#hasPublisher	Vienna University of Technology
https://schema.org/isbn	978-1-4673-2241-6
http://localhost/t...ganizacniJednotka	26220

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