About: PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	This paper describes design, construction and also some recent tests of 3D stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC). These structures have a great potential to create compact structure combining multiple different modules in one package. Internal connections used in these 3D structures have an important role, because they not only provide electrical and signal connection, but they also present mechanical attachment between connected substrates. Goal of this work is to develop, simulate and evaluate new structures based on interesting zero shrink Heraeus HL2000 LTCC substrates, where dimples help to reduce thermo-mechanical stress and pads modified with copper to reduce problems with leaching. This paper describes design, construction and also some recent tests of 3D stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC). These structures have a great potential to create compact structure combining multiple different modules in one package. Internal connections used in these 3D structures have an important role, because they not only provide electrical and signal connection, but they also present mechanical attachment between connected substrates. Goal of this work is to develop, simulate and evaluate new structures based on interesting zero shrink Heraeus HL2000 LTCC substrates, where dimples help to reduce thermo-mechanical stress and pads modified with copper to reduce problems with leaching. (en)
Title	PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS (en)
skos:prefLabel	PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS (en)
skos:notation	RIV/00216305:26220/12:PU100999!RIV14-MSM-26220___
http://linked.open...avai/riv/aktivita	S
http://linked.open...avai/riv/aktivity	S
http://linked.open...vai/riv/dodaniDat	2014
http://linked.open...aciTvurceVysledku	Kosina, Petr Psota, Boleslav Nicák, Michal Šandera, Josef
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	162916
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/12:PU100999
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	Packaging, LTCC, ANSYS, Heraues, soldering (en)
http://linked.open.../riv/klicoveSlovo	soldering Heraues ANSYS LTCC Packaging
http://linked.open...ontrolniKodProRIV	[F94C7C4DB502]
http://linked.open...v/mistoKonaniAkce	Brno
http://linked.open...i/riv/mistoVydani	Tabor 43a,612 00 Brno
http://linked.open...i/riv/nazevZdroje	Electronics Devices and Systems 2012
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	4 (xsd:int)
http://linked.open...cetTvurcuVysledku	5 (xsd:int)
http://linked.open...UplatneniVysledku	2012
http://linked.open...iv/tvurceVysledku	Kosina, Petr Starý, Jiří Psota, Boleslav Nicák, Michal Šandera, Josef
http://linked.open...vavai/riv/typAkce	WRD - Světová
http://linked.open.../riv/zahajeniAkce	2012-06-28 (xsd:date)
number of pages	6 (xsd:int)
http://purl.org/ne...btex#hasPublisher	Ing. Vladislav Novotný - Litera
https://schema.org/isbn	978-80-214-4539-0
http://localhost/t...ganizacniJednotka	26220

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