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Description
| - Three types of thin solid films with the nanoscale inner structures were synthesized by sputtering-deposition and anodizing of Al layer, Al 1.5 at.% Si alloy layer, and Al/Ta bilayer on Si wafers. All the anodic films comprised 1 um thick nanoporous alumina layer as the key component. The essential differences were due to the silicon impurities (AlSi alloy) and the array of nanosized tantalum oxide protrusions in the alumina barrier layer (Al/Ta bilayer).
- Three types of thin solid films with the nanoscale inner structures were synthesized by sputtering-deposition and anodizing of Al layer, Al 1.5 at.% Si alloy layer, and Al/Ta bilayer on Si wafers. All the anodic films comprised 1 um thick nanoporous alumina layer as the key component. The essential differences were due to the silicon impurities (AlSi alloy) and the array of nanosized tantalum oxide protrusions in the alumina barrier layer (Al/Ta bilayer). (en)
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Title
| - Nanostructured alumina-tantala dielectrics for high-frequency integral capacitors
- Nanostructured alumina-tantala dielectrics for high-frequency integral capacitors (en)
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skos:prefLabel
| - Nanostructured alumina-tantala dielectrics for high-frequency integral capacitors
- Nanostructured alumina-tantala dielectrics for high-frequency integral capacitors (en)
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skos:notation
| - RIV/00216305:26220/12:PR26575!RIV13-MSM-26220___
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http://linked.open...avai/riv/aktivita
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http://linked.open...avai/riv/aktivity
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http://linked.open...vai/riv/dodaniDat
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http://linked.open...aciTvurceVysledku
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http://linked.open.../riv/druhVysledku
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http://linked.open...iv/duvernostUdaju
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http://linked.open...onomickeParametry
| - The technology enables high-volume, low-cost solution for electronics and microelectronics Costs for developing 300.000 CZK
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http://linked.open...titaPredkladatele
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http://linked.open...dnocenehoVysledku
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http://linked.open...ai/riv/idVysledku
| - RIV/00216305:26220/12:PR26575
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http://linked.open...terniIdentifikace
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http://linked.open...riv/jazykVysledku
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http://linked.open...vai/riv/kategorie
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http://linked.open.../riv/klicovaSlova
| - porous alumina, tantalum oxide, nanostructure, dielectric properties, electric polarization, integral capacitors, high-frequency performance (en)
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http://linked.open.../riv/klicoveSlovo
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http://linked.open...ontrolniKodProRIV
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http://linked.open...in/vavai/riv/obor
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http://linked.open...ichTvurcuVysledku
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http://linked.open...cetTvurcuVysledku
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http://linked.open...UplatneniVysledku
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http://linked.open...echnickeParametry
| - Precursor films used: Al (99.99%), Al 1.5at.%Si alloy, Al(99,99%)/Ta(99.95%) bilayer; film thicknesses: Al=2000 nm, Al-Si alloy=2000 nm, Al/Ta=700/250 nm; specific capacitance ... 6.5 nF cm-2, dielectric constant ... 7.3-7.35; loss tangent ... (40-60)x10E-4, leakage current at at 1.0 MV cm-1 ... 3x10E-12 Breakdown voltage ... 170-270 V Funkční vzorek byl na základě získaných poznatků zkonstruován a ověřen. Je využíván na pracovišti řešitele LabSensNano (VUT v Brně, Fakulta elektrotechniky a komunikačních technologií, Ústav mikroelektroniky, Technická 3058/10, 616 00 Brno, Česká republika)
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http://linked.open...iv/tvurceVysledku
| - Hubálek, Jaromír
- Mozalev, Alexander
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http://linked.open...avai/riv/vlastnik
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http://linked.open...itiJinymSubjektem
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http://localhost/t...ganizacniJednotka
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