About: Reliability Model for Assessment of Lifetime of Lead-Free Solder Joints

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	The article deals with amalgamation of several methods with the aim to verify reliability of solder joints created with lead-free solder SAC 305. The total number of cycles to failure Nf of solder joints of the test assembly of printed circuit boards (PCB) was theoretically computed at the beginning of the experiment. In the next step, the number of cycles to failure of the solder joints of the test assembly was determined in the Ansys simulation system. A fatigue model based on creep deformation (Schubert et al.) was used for the computation. In order to define the marginal conditions more precisely during the whole duration of the experiment, the temperature on the solder joint was measured as well as the temperatures on the component and the printed circuit board. The lifetime of the solder joints of test assembly was computed using the given fatigue model. To verify the results obtained by the fatigue model and computation method, an experiment was conducted, where the test assemblies were subject The article deals with amalgamation of several methods with the aim to verify reliability of solder joints created with lead-free solder SAC 305. The total number of cycles to failure Nf of solder joints of the test assembly of printed circuit boards (PCB) was theoretically computed at the beginning of the experiment. In the next step, the number of cycles to failure of the solder joints of the test assembly was determined in the Ansys simulation system. A fatigue model based on creep deformation (Schubert et al.) was used for the computation. In order to define the marginal conditions more precisely during the whole duration of the experiment, the temperature on the solder joint was measured as well as the temperatures on the component and the printed circuit board. The lifetime of the solder joints of test assembly was computed using the given fatigue model. To verify the results obtained by the fatigue model and computation method, an experiment was conducted, where the test assemblies were subject (en)
Title	Reliability Model for Assessment of Lifetime of Lead-Free Solder Joints Reliability Model for Assessment of Lifetime of Lead-Free Solder Joints (en)
skos:prefLabel	Reliability Model for Assessment of Lifetime of Lead-Free Solder Joints Reliability Model for Assessment of Lifetime of Lead-Free Solder Joints (en)
skos:notation	RIV/00216305:26220/11:PU96942!RIV14-MPO-26220___
http://linked.open...avai/riv/aktivita	P Z
http://linked.open...avai/riv/aktivity	P(FR-TI1/072), Z(MSM0021630503)
http://linked.open...vai/riv/dodaniDat	2014
http://linked.open...aciTvurceVysledku	Kosina, Petr Szendiuch, Ivan Šandera, Josef Švecová, Olga
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	226455
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/11:PU96942
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	Lead-free solder, solder joint, ANSYS, reliability (en)
http://linked.open.../riv/klicoveSlovo	reliability solder joint ANSYS Lead-free solder
http://linked.open...ontrolniKodProRIV	[33C53BA8C0BF]
http://linked.open...v/mistoKonaniAkce	Brighton
http://linked.open...i/riv/mistoVydani	Brihton, UK
http://linked.open...i/riv/nazevZdroje	18th European microelectronics packaging conference EMPC 2011 - Proceedings
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	4 (xsd:int)
http://linked.open...cetTvurcuVysledku	4 (xsd:int)
http://linked.open...vavai/riv/projekt	Use of Modern Assembly Techniques and Materials in Electronic Industry
http://linked.open...UplatneniVysledku	2011
http://linked.open...iv/tvurceVysledku	Szendiuch, Ivan Kosina, Petr Šandera, Josef Švecová, Olga
http://linked.open...vavai/riv/typAkce	WRD - Světová
http://linked.open.../riv/zahajeniAkce	2011-09-12 (xsd:date)
http://linked.open...n/vavai/riv/zamer	Nové trendy v mikroelektronických systémech a nanotechnologiích (MIKROSYN)
number of pages	5 (xsd:int)
http://purl.org/ne...btex#hasPublisher	Neuveden
https://schema.org/isbn	978-0-9568086-0-8
http://localhost/t...ganizacniJednotka	26220

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