About: Testing of Novel Device for Anodic Bonding process in MEMS Application

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	The paper describes first testing of novel device for anodic bonding process. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass The paper describes first testing of novel device for anodic bonding process. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass (en)
Title	Testing of Novel Device for Anodic Bonding process in MEMS Application Testing of Novel Device for Anodic Bonding process in MEMS Application (en)
skos:prefLabel	Testing of Novel Device for Anodic Bonding process in MEMS Application Testing of Novel Device for Anodic Bonding process in MEMS Application (en)
skos:notation	RIV/00216305:26220/11:PU93800!RIV12-MSM-26220___
http://linked.open...avai/riv/aktivita	P S Z
http://linked.open...avai/riv/aktivity	P(2A-1TP1/143), P(GA102/09/1601), S, Z(MSM0021630503)
http://linked.open...iv/cisloPeriodika	2
http://linked.open...vai/riv/dodaniDat	2012
http://linked.open...aciTvurceVysledku	Pavlík, Michal Háze, Jiří Pekárek, Jan Magát, Martin Vrba, Radimír
http://linked.open.../riv/druhVysledku	J - Článek v odborném periodiku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	234918
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/11:PU93800
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	Anodic bonding process, micro electro-mechanical systems (MEMS), tensile test. (en)
http://linked.open.../riv/klicoveSlovo	Anodic bonding process micro electro-mechanical systems (MEMS) tensile test.
http://linked.open...odStatuVydavatele	BG - Bulharská republika
http://linked.open...ontrolniKodProRIV	[C956392E2DD7]
http://linked.open...i/riv/nazevZdroje	Electronics
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	5 (xsd:int)
http://linked.open...cetTvurcuVysledku	5 (xsd:int)
http://linked.open...vavai/riv/projekt	Intelligent micro and nano structures for microsensors realized with support of nanotechnology Research of novel mechatronic MEMS structures for pressure measurements
http://linked.open...UplatneniVysledku	2011
http://linked.open...v/svazekPeriodika	5
http://linked.open...iv/tvurceVysledku	Háze, Jiří Magát, Martin Pavlík, Michal Pekárek, Jan Vrba, Radimír
http://linked.open...n/vavai/riv/zamer	Nové trendy v mikroelektronických systémech a nanotechnologiích (MIKROSYN)
issn	1313-1842
number of pages	3 (xsd:int)
http://localhost/t...ganizacniJednotka	26220

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