About: On the Application of 3D LTCC and Flexible Structures Based on Galvanized Layers

Facets (new session)
Description
Metadata
Settings
- owl:sameAs
- Inference Rule:

About: On the Application of 3D LTCC and Flexible Structures Based on Galvanized Layers Goto Sponge NotDistinct Permalink

An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

Attributes	Values
rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
rdfs:seeAlso	http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6053560
Description	This paper describes design, construction and some recent tests of three dimensional stacked structures. These structures have great potential to realize compact structures combining multiple different applications in one package. Interconnections used in these structures pay important role in packaging. They not only provide electrical connection, but they also act as mechanical attachment between substrates and are supposed to be reliable. Approach mentioned in this paper might lead to increase of reliability of 3D interconnections. Goal of this work is development and implementation of reliable 3D stacked structures, where LTCC, Al2O3 and also flexible substrates can be connected together in one package by interconnections that are based on vacuum evaporated and galvanically reinforced conductive layers of several types - fixed planar and elastic ones, both in connection with solder balls. This paper describes design, construction and some recent tests of three dimensional stacked structures. These structures have great potential to realize compact structures combining multiple different applications in one package. Interconnections used in these structures pay important role in packaging. They not only provide electrical connection, but they also act as mechanical attachment between substrates and are supposed to be reliable. Approach mentioned in this paper might lead to increase of reliability of 3D interconnections. Goal of this work is development and implementation of reliable 3D stacked structures, where LTCC, Al2O3 and also flexible substrates can be connected together in one package by interconnections that are based on vacuum evaporated and galvanically reinforced conductive layers of several types - fixed planar and elastic ones, both in connection with solder balls. (en)
Title	On the Application of 3D LTCC and Flexible Structures Based on Galvanized Layers On the Application of 3D LTCC and Flexible Structures Based on Galvanized Layers (en)
skos:prefLabel	On the Application of 3D LTCC and Flexible Structures Based on Galvanized Layers On the Application of 3D LTCC and Flexible Structures Based on Galvanized Layers (en)
skos:notation	RIV/00216305:26220/11:PU93661!RIV12-MSM-26220___
http://linked.open...avai/riv/aktivita	Z
http://linked.open...avai/riv/aktivity	Z(MSM0021630503)
http://linked.open...vai/riv/dodaniDat	2012
http://linked.open...aciTvurceVysledku	Nicák, Michal Šandera, Josef
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	218168
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/11:PU93661
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	3D structures, LTCC, vacuum evaporation, galvanic processes (en)
http://linked.open.../riv/klicoveSlovo	3D structures galvanic processes vacuum evaporation LTCC
http://linked.open...ontrolniKodProRIV	[B7B4B8D256A8]
http://linked.open...v/mistoKonaniAkce	Tatranská Lomnica
http://linked.open...i/riv/mistoVydani	Košice, SK
http://linked.open...i/riv/nazevZdroje	ISSE 2011 - PROCEEDINGS
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	2 (xsd:int)
http://linked.open...cetTvurcuVysledku	2 (xsd:int)
http://linked.open...UplatneniVysledku	2011
http://linked.open...iv/tvurceVysledku	Nicák, Michal Šandera, Josef
http://linked.open...vavai/riv/typAkce	EUR - Evropská
http://linked.open.../riv/zahajeniAkce	2011-05-11 (xsd:date)
http://linked.open...n/vavai/riv/zamer	Nové trendy v mikroelektronických systémech a nanotechnologiích (MIKROSYN)
number of pages	3 (xsd:int)
http://purl.org/ne...btex#hasPublisher	Technická Univerzita Košice
https://schema.org/isbn	978-1-4577-2111-3
http://localhost/t...ganizacniJednotka	26220

Faceted Search & Find service v1.16.118 as of Jun 21 2024

Alternative Linked Data Documents: ODE Content Formats:

RDF

ODATA

Microdata

About

OpenLink Virtuoso version 07.20.3240 as of Jun 21 2024, on Linux (x86_64-pc-linux-gnu), Single-Server Edition (126 GB total memory, 48 GB memory in use)
Data on this page belongs to its respective rights holders.
Virtuoso Faceted Browser Copyright © 2009-2024 OpenLink Software