About: 3D LTCC and Flexible Structure Interconnections Based on Galvanized Layers

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

Attributes	Values
rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
rdfs:seeAlso	http://www.citizen-testdomain.co.uk/technical-conference/
Description	Interconnections have an important role in packaging as they not only provide electrical connection but they also act as mechanical attachment between connected substrates and are supposed to be as reliable as possible. This paper describes design, construction and some recent laboratory tests of 3D stacked structures, where different materials with different coefficient of thermal expansion are combined together in one package. Goal of this work is to develop reliable 3D stacked structure intercronnection method, which will allow connection between LTCC, Al2O3 and also flexible substrates. Vacuum evaporated and galvanically enhanced layers in connection with solder balls are used to create interconnections between substrates. Interconnections have an important role in packaging as they not only provide electrical connection but they also act as mechanical attachment between connected substrates and are supposed to be as reliable as possible. This paper describes design, construction and some recent laboratory tests of 3D stacked structures, where different materials with different coefficient of thermal expansion are combined together in one package. Goal of this work is to develop reliable 3D stacked structure intercronnection method, which will allow connection between LTCC, Al2O3 and also flexible substrates. Vacuum evaporated and galvanically enhanced layers in connection with solder balls are used to create interconnections between substrates. (en)
Title	3D LTCC and Flexible Structure Interconnections Based on Galvanized Layers 3D LTCC and Flexible Structure Interconnections Based on Galvanized Layers (en)
skos:prefLabel	3D LTCC and Flexible Structure Interconnections Based on Galvanized Layers 3D LTCC and Flexible Structure Interconnections Based on Galvanized Layers (en)
skos:notation	RIV/00216305:26220/11:PU93660!RIV12-MSM-26220___
http://linked.open...avai/riv/aktivita	S Z
http://linked.open...avai/riv/aktivity	S, Z(MSM0021630503)
http://linked.open...vai/riv/dodaniDat	2012
http://linked.open...aciTvurceVysledku	Nicák, Michal Šandera, Josef
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	244080
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/11:PU93660
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	LTCC, 3D, interconnection, structure, packaging (en)
http://linked.open.../riv/klicoveSlovo	3D structure interconnection packaging LTCC
http://linked.open...ontrolniKodProRIV	[068D2FCA8410]
http://linked.open...v/mistoKonaniAkce	Brighton
http://linked.open...i/riv/mistoVydani	Brighton, UK
http://linked.open...i/riv/nazevZdroje	Proceedings of 18th European microelectronics packaging conference EMPC 2011
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	2 (xsd:int)
http://linked.open...cetTvurcuVysledku	2 (xsd:int)
http://linked.open...UplatneniVysledku	2011
http://linked.open...iv/tvurceVysledku	Nicák, Michal Šandera, Josef
http://linked.open...vavai/riv/typAkce	WRD - Světová
http://linked.open.../riv/zahajeniAkce	2011-09-12 (xsd:date)
http://linked.open...n/vavai/riv/zamer	Nové trendy v mikroelektronických systémech a nanotechnologiích (MIKROSYN)
number of pages	4 (xsd:int)
http://purl.org/ne...btex#hasPublisher	IMAPS-Europe
https://schema.org/isbn	978-0-9568086-0-8
http://localhost/t...ganizacniJednotka	26220

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