About: Reliability and Simulation of Lead-Free Solder Joint Behavior in 3D Packaging Structure     Goto   Sponge   NotDistinct   Permalink

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  • This paper deals with behavior of lead-free solder joint applied in 3D electronic packaging structure. There are plenty of factors which influences reliability and life-time of solder compound connection. Type of substrates, selection of materials and process arrangement are the main areas to investigate. The content consists from three main parts. The first deals with introduction of designed test pattern, material, and process arrangement and applied testing methods. Second part continues with ANSYS software simulation of solder interconnections during thermo-mechanical stress tests and third part is aimed to experimental evaluation of results in the comparison to simulated results.
  • This paper deals with behavior of lead-free solder joint applied in 3D electronic packaging structure. There are plenty of factors which influences reliability and life-time of solder compound connection. Type of substrates, selection of materials and process arrangement are the main areas to investigate. The content consists from three main parts. The first deals with introduction of designed test pattern, material, and process arrangement and applied testing methods. Second part continues with ANSYS software simulation of solder interconnections during thermo-mechanical stress tests and third part is aimed to experimental evaluation of results in the comparison to simulated results. (en)
Title
  • Reliability and Simulation of Lead-Free Solder Joint Behavior in 3D Packaging Structure
  • Reliability and Simulation of Lead-Free Solder Joint Behavior in 3D Packaging Structure (en)
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  • Reliability and Simulation of Lead-Free Solder Joint Behavior in 3D Packaging Structure
  • Reliability and Simulation of Lead-Free Solder Joint Behavior in 3D Packaging Structure (en)
skos:notation
  • RIV/00216305:26220/11:PU90508!RIV11-MSM-26220___
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • Z(MSM0021630503)
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
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http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
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  • 226452
http://linked.open...ai/riv/idVysledku
  • RIV/00216305:26220/11:PU90508
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • 3D Packaging, ANSYS, Lead-free, Reliability, Solder joint (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [044B69E96B99]
http://linked.open...v/mistoKonaniAkce
  • Brno
http://linked.open...i/riv/mistoVydani
  • Švýcarsko
http://linked.open...i/riv/nazevZdroje
  • Key Engineering Materials Vol. 465 (2011)
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...UplatneniVysledku
http://linked.open...iv/tvurceVysledku
  • Pulec, Jiří
  • Szendiuch, Ivan
  • Nicák, Michal
  • Šandera, Josef
  • Švecová, Olga
http://linked.open...vavai/riv/typAkce
http://linked.open.../riv/zahajeniAkce
http://linked.open...n/vavai/riv/zamer
number of pages
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  • Trans Tech Publications
https://schema.org/isbn
  • 978-3-03785-006-0
http://localhost/t...ganizacniJednotka
  • 26220
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