Facets (new session)
Description
Metadata
Settings
owl:sameAs
Inference Rule:
asEquivalent
b3s
b3sifp
facets
http://www.w3.org/2002/07/owl#
ldp
oplweb
skos-trans
virtrdf-label
virtrdf-url
None
About:
Reliability of Electronic Modules Connected with Chip Components
Goto
Sponge
NotDistinct
Permalink
An Entity of Type :
http://linked.opendata.cz/ontology/domain/vavai/Vysledek
, within Data Space :
linked.opendata.cz
associated with source
document(s)
Type:
skos:Concept
http://linked.opendata.cz/ontology/domain/vavai/Vysledek
New Facet based on Instances of this Class
Attributes
Values
rdf:type
skos:Concept
http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description
Measuring thermomechanical reliability of modules connection by influence of topology connection.
Measuring thermomechanical reliability of modules connection by influence of topology connection.
(en)
Title
Reliability of Electronic Modules Connected with Chip Components
Reliability of Electronic Modules Connected with Chip Components
(en)
skos:prefLabel
Reliability of Electronic Modules Connected with Chip Components
Reliability of Electronic Modules Connected with Chip Components
(en)
skos:notation
RIV/00216305:26220/10:PU90422!RIV11-MPO-26220___
http://linked.open...avai/riv/aktivita
P
http://linked.open...avai/riv/aktivity
P(FR-TI1/072)
http://linked.open...vai/riv/dodaniDat
2011
http://linked.open...aciTvurceVysledku
Šandera, Josef
http://linked.open.../riv/druhVysledku
D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju
S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele
Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku
284710
http://linked.open...ai/riv/idVysledku
RIV/00216305:26220/10:PU90422
http://linked.open...riv/jazykVysledku
eng - angličtina
http://linked.open.../riv/klicovaSlova
Ceramic modules, chip packages, LF solder, thermomechanical reliability
(en)
http://linked.open.../riv/klicoveSlovo
thermomechanical reliability
Ceramic modules
LF solder
chip packages
http://linked.open...ontrolniKodProRIV
[0171C93680AE]
http://linked.open...v/mistoKonaniAkce
Brno
http://linked.open...i/riv/mistoVydani
Brno
http://linked.open...i/riv/nazevZdroje
Electronic Devices and Systems - EDS 10, IMAPS CS International Conference 2010
http://linked.open...in/vavai/riv/obor
JA
http://linked.open...ichTvurcuVysledku
1
(
xsd:int
)
http://linked.open...cetTvurcuVysledku
1
(
xsd:int
)
http://linked.open...vavai/riv/projekt
Use of Modern Assembly Techniques and Materials in Electronic Industry
http://linked.open...UplatneniVysledku
2010
http://linked.open...iv/tvurceVysledku
Šandera, Josef
http://linked.open...vavai/riv/typAkce
WRD - Světová
http://linked.open.../riv/zahajeniAkce
2010-09-01
(
xsd:date
)
number of pages
4
(
xsd:int
)
http://purl.org/ne...btex#hasPublisher
VUT v Brně, Antonínská 1
https://schema.org/isbn
978-80-214-4138-5
http://localhost/t...ganizacniJednotka
26220
Faceted Search & Find service v1.16.118 as of Jun 21 2024
Alternative Linked Data Documents:
ODE
Content Formats:
RDF
ODATA
Microdata
About
OpenLink Virtuoso
version 07.20.3240 as of Jun 21 2024, on Linux (x86_64-pc-linux-gnu), Single-Server Edition (126 GB total memory, 48 GB memory in use)
Data on this page belongs to its respective rights holders.
Virtuoso Faceted Browser Copyright © 2009-2024 OpenLink Software