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  • The article discusses the possibility of electrically connecting two or more boards or modules used in electronics and microelectronics and the first results of reliability testing of a structure connected by SMD components. The test structures were cyclically exposed to thermal load in the temperature range -20C to +100C, with dwell time of 10 minutes at maximum and minimum temperature. Test samples are based on alumina and mounted with SMD components with package of size 0603. Test samples are soldered to boards with immersion gold surface finish. The aim of the experiment is to determine the lifetime of a structure connected by SMD components in respect to varying coefficient of thermal expansion of base materials.
  • The article discusses the possibility of electrically connecting two or more boards or modules used in electronics and microelectronics and the first results of reliability testing of a structure connected by SMD components. The test structures were cyclically exposed to thermal load in the temperature range -20C to +100C, with dwell time of 10 minutes at maximum and minimum temperature. Test samples are based on alumina and mounted with SMD components with package of size 0603. Test samples are soldered to boards with immersion gold surface finish. The aim of the experiment is to determine the lifetime of a structure connected by SMD components in respect to varying coefficient of thermal expansion of base materials. (en)
Title
  • The Connecting of Electronic Modules Using SMD Components' Package
  • The Connecting of Electronic Modules Using SMD Components' Package (en)
skos:prefLabel
  • The Connecting of Electronic Modules Using SMD Components' Package
  • The Connecting of Electronic Modules Using SMD Components' Package (en)
skos:notation
  • RIV/00216305:26220/10:PU89898!RIV11-MPO-26220___
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • P(FR-TI1/072)
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 251862
http://linked.open...ai/riv/idVysledku
  • RIV/00216305:26220/10:PU89898
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • Connecting, SMD, reliability, lead-free solder. (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [B08ACC328B2A]
http://linked.open...v/mistoKonaniAkce
  • Berlin
http://linked.open...i/riv/mistoVydani
  • Berlín, Neměcko
http://linked.open...i/riv/nazevZdroje
  • Electronics System Integration Technology Conference ESTC 2010 in Berlin
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...vavai/riv/projekt
http://linked.open...UplatneniVysledku
http://linked.open...iv/tvurceVysledku
  • Šandera, Josef
  • Švecová, Olga
http://linked.open...vavai/riv/typAkce
http://linked.open.../riv/zahajeniAkce
number of pages
http://purl.org/ne...btex#hasPublisher
  • Neuveden
https://schema.org/isbn
  • 978-1-4244-8555-0
http://localhost/t...ganizacniJednotka
  • 26220
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