About: A Novel Laboratory Anodic Bonding Device for MEMS Applications

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	The article deals with a novel laboratory anodic bonding device. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. It is one of the important steps of MEMS components packaging. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass. The article deals with a novel laboratory anodic bonding device. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. It is one of the important steps of MEMS components packaging. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass. (en)
Title	A Novel Laboratory Anodic Bonding Device for MEMS Applications A Novel Laboratory Anodic Bonding Device for MEMS Applications (en)
skos:prefLabel	A Novel Laboratory Anodic Bonding Device for MEMS Applications A Novel Laboratory Anodic Bonding Device for MEMS Applications (en)
skos:notation	RIV/00216305:26220/10:PU89746!RIV11-GA0-26220___
http://linked.open...avai/riv/aktivita	P Z
http://linked.open...avai/riv/aktivity	P(2A-1TP1/143), P(GA102/09/1601), Z(MSM0021630503)
http://linked.open...iv/cisloPeriodika	3
http://linked.open...vai/riv/dodaniDat	2011
http://linked.open...aciTvurceVysledku	Pavlík, Michal Háze, Jiří Pekárek, Jan Vrba, Radimír
http://linked.open.../riv/druhVysledku	J - Článek v odborném periodiku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	244828
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/10:PU89746
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	anodic bonding, MEMS (en)
http://linked.open.../riv/klicoveSlovo	anodic bonding MEMS
http://linked.open...odStatuVydavatele	CZ - Česká republika
http://linked.open...ontrolniKodProRIV	[180AC7E07C32]
http://linked.open...i/riv/nazevZdroje	ElectroScope - http://www.electroscope.zcu.cz
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	4 (xsd:int)
http://linked.open...cetTvurcuVysledku	4 (xsd:int)
http://linked.open...vavai/riv/projekt	Intelligent micro and nano structures for microsensors realized with support of nanotechnology Research of novel mechatronic MEMS structures for pressure measurements
http://linked.open...UplatneniVysledku	2010
http://linked.open...v/svazekPeriodika	2010
http://linked.open...iv/tvurceVysledku	Háze, Jiří Pavlík, Michal Pekárek, Jan Vrba, Radimír
http://linked.open...n/vavai/riv/zamer	Nové trendy v mikroelektronických systémech a nanotechnologiích (MIKROSYN)
issn	1802-4564
number of pages	3 (xsd:int)
http://localhost/t...ganizacniJednotka	26220

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