About: Committing of electronic modules by ball pins and their reliability

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	The article states first results of reliability measurement of committing of electronic modules with printed circuit board by lead-free solder balls (SAC 305). The measurements are still in progress, 1100 cycles have been performed up to now. In order to obtain experimental data, the test boards are periodically exposed to thermal load from -20 to +100 degrees centigrade with 20 minutes dwell time on the maximum and minimum temperatures. Test samples are produced on alumina ceramics and/or four-layer LTCC ceramics. Test samples are soldered onto boards with various surface finishes: galvanic gold and HAL. The goal of the experiment is to determine the lifetime of ball solder joints in relation to varying thermal conductivity coefficient of base materials. The article states first results of reliability measurement of committing of electronic modules with printed circuit board by lead-free solder balls (SAC 305). The measurements are still in progress, 1100 cycles have been performed up to now. In order to obtain experimental data, the test boards are periodically exposed to thermal load from -20 to +100 degrees centigrade with 20 minutes dwell time on the maximum and minimum temperatures. Test samples are produced on alumina ceramics and/or four-layer LTCC ceramics. Test samples are soldered onto boards with various surface finishes: galvanic gold and HAL. The goal of the experiment is to determine the lifetime of ball solder joints in relation to varying thermal conductivity coefficient of base materials. (en)
Title	Committing of electronic modules by ball pins and their reliability Committing of electronic modules by ball pins and their reliability (en)
skos:prefLabel	Committing of electronic modules by ball pins and their reliability Committing of electronic modules by ball pins and their reliability (en)
skos:notation	RIV/00216305:26220/10:PU88134!RIV11-MPO-26220___
http://linked.open...avai/riv/aktivita	P
http://linked.open...avai/riv/aktivity	P(FR-TI1/072)
http://linked.open...vai/riv/dodaniDat	2011
http://linked.open...aciTvurceVysledku	Kosina, Petr Adámek, Martin Šandera, Josef Švecová, Olga
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	251261
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/10:PU88134
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	Lead-free solder, solder joint, reliability, LTCC (en)
http://linked.open.../riv/klicoveSlovo	reliability solder joint LTCC Lead-free solder
http://linked.open...ontrolniKodProRIV	[BC859C2FC97E]
http://linked.open...v/mistoKonaniAkce	Warsaw
http://linked.open...i/riv/mistoVydani	Neuveden
http://linked.open...i/riv/nazevZdroje	Electronics Technology (ISSE), 2010 33rd International Spring Seminar on
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	4 (xsd:int)
http://linked.open...cetTvurcuVysledku	4 (xsd:int)
http://linked.open...vavai/riv/projekt	Use of Modern Assembly Techniques and Materials in Electronic Industry
http://linked.open...UplatneniVysledku	2010
http://linked.open...iv/tvurceVysledku	Kosina, Petr Adámek, Martin Šandera, Josef Švecová, Olga
http://linked.open...vavai/riv/typAkce	EUR - Evropská
http://linked.open.../riv/zahajeniAkce	2010-05-12 (xsd:date)
number of pages	4 (xsd:int)
http://purl.org/ne...btex#hasPublisher	Neuveden
https://schema.org/isbn	978-1-4244-7849-1
http://localhost/t...ganizacniJednotka	26220

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