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  • This paper describes design, construction and some recent test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls. This three dimensional technology offers great potential to very compact embedded structures which may include as hybrid integrated circuits (HIC) well as non-conventional applications (sensors, attenuators etc).
  • This paper describes design, construction and some recent test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls. This three dimensional technology offers great potential to very compact embedded structures which may include as hybrid integrated circuits (HIC) well as non-conventional applications (sensors, attenuators etc). (en)
Title
  • Contribution to realization of 3D structures
  • Contribution to realization of 3D structures (en)
skos:prefLabel
  • Contribution to realization of 3D structures
  • Contribution to realization of 3D structures (en)
skos:notation
  • RIV/00216305:26220/10:PU88083!RIV11-GA0-26220___
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • P(GA102/09/1701), S, Z(MSM0021630503)
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 252020
http://linked.open...ai/riv/idVysledku
  • RIV/00216305:26220/10:PU88083
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • 3D, stacked, AL2O3, LTCC (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [C24F794CBD7C]
http://linked.open...v/mistoKonaniAkce
  • Warsaw
http://linked.open...i/riv/mistoVydani
  • Warsaw, Poland
http://linked.open...i/riv/nazevZdroje
  • 33rd International Spring Seminar on Electronics Technology (ISSE), 2010
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...vavai/riv/projekt
http://linked.open...UplatneniVysledku
http://linked.open...iv/tvurceVysledku
  • Szendiuch, Ivan
  • Nicák, Michal
  • Šandera, Josef
http://linked.open...vavai/riv/typAkce
http://linked.open.../riv/zahajeniAkce
http://linked.open...n/vavai/riv/zamer
number of pages
http://purl.org/ne...btex#hasPublisher
  • IEEE Xplore digital library
https://schema.org/isbn
  • 978-1-4244-7849-1
http://localhost/t...ganizacniJednotka
  • 26220
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