About: CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	This paper describes design, construction and some test results of lead-free soldered three dimensional structures based on combination of stacked thick-film Al2O3 and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls. This paper describes design, construction and some test results of lead-free soldered three dimensional structures based on combination of stacked thick-film Al2O3 and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls. (en)
Title	CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES (en)
skos:prefLabel	CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES (en)
skos:notation	RIV/00216305:26220/10:PU87238!RIV11-GA0-26220___
http://linked.open...avai/riv/aktivita	P S Z
http://linked.open...avai/riv/aktivity	P(GA102/09/1701), S, Z(MSM0021630503)
http://linked.open...vai/riv/dodaniDat	2011
http://linked.open...aciTvurceVysledku	Szendiuch, Ivan Nicák, Michal
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	252015
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/10:PU87238
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	packaging, stacking, 3D structures, lead-free, thick-film (en)
http://linked.open.../riv/klicoveSlovo	thick-film 3D structures lead-free stacking packaging
http://linked.open...ontrolniKodProRIV	[1A129CDC85BA]
http://linked.open...v/mistoKonaniAkce	Izhevsk
http://linked.open...i/riv/mistoVydani	Izhevsk, Russia
http://linked.open...i/riv/nazevZdroje	Second Forum of Young Researchers. In the framework of International Forum %22Education Quality - 2010%22 : Proceedings
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	2 (xsd:int)
http://linked.open...cetTvurcuVysledku	2 (xsd:int)
http://linked.open...vavai/riv/projekt	Research and Development of the New Soldering Principles for Increasing of Solder Joints Reliability
http://linked.open...UplatneniVysledku	2010
http://linked.open...iv/tvurceVysledku	Szendiuch, Ivan Nicák, Michal
http://linked.open...vavai/riv/typAkce	WRD - Světová
http://linked.open.../riv/zahajeniAkce	2010-04-21 (xsd:date)
http://linked.open...n/vavai/riv/zamer	Nové trendy v mikroelektronických systémech a nanotechnologiích (MIKROSYN)
number of pages	444 (xsd:int)
http://purl.org/ne...btex#hasPublisher	Publishing House of ISTU
https://schema.org/isbn	978-5-7526-0442-3
http://localhost/t...ganizacniJednotka	26220

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