About: Contribution to realization of 3D structures

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

Attributes	Values
rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	This paper describes design, construction and some recent test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls. This three dimensional technology offers great potential to very compact embedded structures which may include as hybrid integrated circuits (HIC) well as non-conventional applications (sensors, attenuators etc). This paper describes design, construction and some recent test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls. This three dimensional technology offers great potential to very compact embedded structures which may include as hybrid integrated circuits (HIC) well as non-conventional applications (sensors, attenuators etc). (en)
Title	Contribution to realization of 3D structures Contribution to realization of 3D structures (en)
skos:prefLabel	Contribution to realization of 3D structures Contribution to realization of 3D structures (en)
skos:notation	RIV/00216305:26220/10:PU87237!RIV11-GA0-26220___
http://linked.open...avai/riv/aktivita	P Z
http://linked.open...avai/riv/aktivity	P(FR-TI1/072), P(GA102/09/1701), Z(MSM0021630503)
http://linked.open...vai/riv/dodaniDat	2011
http://linked.open...aciTvurceVysledku	Szendiuch, Ivan Nicák, Michal
http://linked.open.../riv/druhVysledku	O - Ostatní výsledky nezařaditelné do žádného z výše uvedených druhů výsledku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	252021
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/10:PU87237
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	Lead-free solder, solder joint, Al2O3, LTCC (en)
http://linked.open.../riv/klicoveSlovo	Al2O3 solder joint LTCC Lead-free solder
http://linked.open...ontrolniKodProRIV	[90696BA50729]
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	2 (xsd:int)
http://linked.open...cetTvurcuVysledku	2 (xsd:int)
http://linked.open...vavai/riv/projekt	Use of Modern Assembly Techniques and Materials in Electronic Industry Research and Development of the New Soldering Principles for Increasing of Solder Joints Reliability
http://linked.open...UplatneniVysledku	2010
http://linked.open...iv/tvurceVysledku	Szendiuch, Ivan Nicák, Michal
http://linked.open...n/vavai/riv/zamer	Nové trendy v mikroelektronických systémech a nanotechnologiích (MIKROSYN)
http://localhost/t...ganizacniJednotka	26220

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