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Description
| - The article states first results of reliability measurement of committing of electronic modules with printed circuit board by lead-free solder balls (SAC 305). The measurements are still in progress, 1100 cycles have been performed up to now. In order to obtain experimental data, the test boards are periodically exposed to thermal load from -20 to +100 degrees centigrade with 20 minutes dwell time on the maximum and minimum temperatures. Test samples are produced on alumina ceramics and/or four-layer LTCC ceramics. Test samples are soldered onto boards with various surface finishes: galvanic gold and HAL. The goal of the experiment is to determine the lifetime of ball solder joints in relation to varying thermal conductivity coefficient of base materials.
- The article states first results of reliability measurement of committing of electronic modules with printed circuit board by lead-free solder balls (SAC 305). The measurements are still in progress, 1100 cycles have been performed up to now. In order to obtain experimental data, the test boards are periodically exposed to thermal load from -20 to +100 degrees centigrade with 20 minutes dwell time on the maximum and minimum temperatures. Test samples are produced on alumina ceramics and/or four-layer LTCC ceramics. Test samples are soldered onto boards with various surface finishes: galvanic gold and HAL. The goal of the experiment is to determine the lifetime of ball solder joints in relation to varying thermal conductivity coefficient of base materials. (en)
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Title
| - Committing of electronic modules by ball pins and their reliability
- Committing of electronic modules by ball pins and their reliability (en)
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skos:prefLabel
| - Committing of electronic modules by ball pins and their reliability
- Committing of electronic modules by ball pins and their reliability (en)
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skos:notation
| - RIV/00216305:26220/10:PU87067!RIV11-MPO-26220___
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http://linked.open...avai/riv/aktivita
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http://linked.open...avai/riv/aktivity
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http://linked.open...vai/riv/dodaniDat
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http://linked.open...aciTvurceVysledku
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http://linked.open.../riv/druhVysledku
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http://linked.open...iv/duvernostUdaju
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http://linked.open...titaPredkladatele
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http://linked.open...dnocenehoVysledku
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http://linked.open...ai/riv/idVysledku
| - RIV/00216305:26220/10:PU87067
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http://linked.open...riv/jazykVysledku
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http://linked.open.../riv/klicovaSlova
| - Lead-free solder, solder joint, reliability, LTCC (en)
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http://linked.open.../riv/klicoveSlovo
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http://linked.open...ontrolniKodProRIV
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http://linked.open...in/vavai/riv/obor
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http://linked.open...ichTvurcuVysledku
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http://linked.open...cetTvurcuVysledku
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http://linked.open...vavai/riv/projekt
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http://linked.open...UplatneniVysledku
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http://linked.open...iv/tvurceVysledku
| - Kosina, Petr
- Adámek, Martin
- Šandera, Josef
- Švecová, Olga
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http://localhost/t...ganizacniJednotka
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