About: New trends of BGA Soldering in education

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	This paper deals with the problematic of modern soldering technologies and the implementation of new trends of modern soldering technologies into education process. It describes the possibilities of implementation of modern equipment in the education process, concretely in courses specialized to modern technologies of electronic circuits and systems. The possibilities of 3-D structures and BGA soldering using own prepared ceramic and organic based samples were presented. The samples with deposited solder paste using stencil printing techniques were assembled using Fritch microplacer and soldered using vapor phase soldering device Asscon Quicky 300. The final inspection of soldered joints was made using Ersascope special optical inspection device. Finally it was found that this process is suitable for practical education in the lessons of modern packaging and systems subjects. This paper deals with the problematic of modern soldering technologies and the implementation of new trends of modern soldering technologies into education process. It describes the possibilities of implementation of modern equipment in the education process, concretely in courses specialized to modern technologies of electronic circuits and systems. The possibilities of 3-D structures and BGA soldering using own prepared ceramic and organic based samples were presented. The samples with deposited solder paste using stencil printing techniques were assembled using Fritch microplacer and soldered using vapor phase soldering device Asscon Quicky 300. The final inspection of soldered joints was made using Ersascope special optical inspection device. Finally it was found that this process is suitable for practical education in the lessons of modern packaging and systems subjects. (en)
Title	New trends of BGA Soldering in education New trends of BGA Soldering in education (en)
skos:prefLabel	New trends of BGA Soldering in education New trends of BGA Soldering in education (en)
skos:notation	RIV/00216305:26220/09:PU83867!RIV11-MSM-26220___
http://linked.open...avai/riv/aktivita	P S
http://linked.open...avai/riv/aktivity	P(2E08051), S
http://linked.open...iv/cisloPeriodika	2
http://linked.open...vai/riv/dodaniDat	2011
http://linked.open...aciTvurceVysledku	Prášek, Jan Adámek, Martin Nicák, Michal
http://linked.open.../riv/druhVysledku	J - Článek v odborném periodiku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	329495
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/09:PU83867
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	Education, BGA, Soldering, 3-D packaging (en)
http://linked.open.../riv/klicoveSlovo	BGA Education Soldering 3-D packaging
http://linked.open...odStatuVydavatele	BG - Bulharská republika
http://linked.open...ontrolniKodProRIV	[CC75D8389CCC]
http://linked.open...i/riv/nazevZdroje	Electronics
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	3 (xsd:int)
http://linked.open...cetTvurcuVysledku	3 (xsd:int)
http://linked.open...vavai/riv/projekt	Research of methods and techniques for general public familiarization with a researcher work by information technologies
http://linked.open...UplatneniVysledku	2009
http://linked.open...v/svazekPeriodika	3
http://linked.open...iv/tvurceVysledku	Prášek, Jan Adámek, Martin Nicák, Michal
issn	1313-1842
number of pages	3 (xsd:int)
http://localhost/t...ganizacniJednotka	26220

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