About: New Facts from lead-free Solders Reliability Investigation

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

Attributes	Values
rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	There are done many research works following investigation of lead-free solders, and differently results are achieved for identical solder materials. The reason is simple, the same solder compound can show diverse results when other material and process parameters are different. That is reason why we have addicted on investigation of some critical areas which has significant impact on solder joint reliability and lifetime. At length the soldering area should be divided in three principal parts that are materials and components, process and equipments, and design and testing. Our actual research work at Brno University of Technology is focused on soldering process parameters impact on solder joint structure, on wetting angle changes in dependence on material/process parameters and on thermo mechanical strain of soldered joints. There are done many research works following investigation of lead-free solders, and differently results are achieved for identical solder materials. The reason is simple, the same solder compound can show diverse results when other material and process parameters are different. That is reason why we have addicted on investigation of some critical areas which has significant impact on solder joint reliability and lifetime. At length the soldering area should be divided in three principal parts that are materials and components, process and equipments, and design and testing. Our actual research work at Brno University of Technology is focused on soldering process parameters impact on solder joint structure, on wetting angle changes in dependence on material/process parameters and on thermo mechanical strain of soldered joints. (en)
Title	New Facts from lead-free Solders Reliability Investigation New Facts from lead-free Solders Reliability Investigation (en)
skos:prefLabel	New Facts from lead-free Solders Reliability Investigation New Facts from lead-free Solders Reliability Investigation (en)
skos:notation	RIV/00216305:26220/09:PU83364!RIV10-MSM-26220___
http://linked.open...avai/riv/aktivita	P Z
http://linked.open...avai/riv/aktivity	P(GA102/09/1701), Z(MSM0021630503)
http://linked.open...vai/riv/dodaniDat	2010
http://linked.open...aciTvurceVysledku	Buršík, Martin Hejátková, Edita Szendiuch, Ivan Starý, Jiří Šandera, Josef
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	329367
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/09:PU83364
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	lead-free solderig (en)
http://linked.open.../riv/klicoveSlovo	lead-free solderig
http://linked.open...ontrolniKodProRIV	[B7700794F2FE]
http://linked.open...v/mistoKonaniAkce	Rimini
http://linked.open...i/riv/mistoVydani	Rimini, Italy
http://linked.open...i/riv/nazevZdroje	17th European Microelectronics and Packaging Conference
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	5 (xsd:int)
http://linked.open...cetTvurcuVysledku	5 (xsd:int)
http://linked.open...vavai/riv/projekt	Research and Development of the New Soldering Principles for Increasing of Solder Joints Reliability
http://linked.open...UplatneniVysledku	2009
http://linked.open...iv/tvurceVysledku	Szendiuch, Ivan Buršík, Martin Starý, Jiří Hejátková, Edita Šandera, Josef
http://linked.open...vavai/riv/typAkce	WRD - Světová
http://linked.open.../riv/zahajeniAkce	2009-06-15 (xsd:date)
http://linked.open...n/vavai/riv/zamer	Nové trendy v mikroelektronických systémech a nanotechnologiích (MIKROSYN)
number of pages	6 (xsd:int)
http://purl.org/ne...btex#hasPublisher	IMAPS Italy
https://schema.org/isbn	978-1-4244-4722-0
http://localhost/t...ganizacniJednotka	26220

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