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Description
| - This work deals with alternative method for mono-crystalline surface cleaning and activation by means of low pressure plasma-hydrogen etching. The gas mixture of Ar/H2 is used for etch process. Hydrogen plasma etching can removes native oxide layer very efficiently and also it facilitates high-quality passivation effect due to the silicon surface hydrogenation. A reactive SiNx:H sputtering process follows after the plasma-hydrogen etching process using the Ar/N2/H2 gas mixture. Both etching and sputtering are performed in one vacuum cycle. The aim of such processing is in elimination of SiOX interlayer formation that could be created on the substrate can lead to formation of very thin SiOxNy layer on the silicon/layer interface after start of SiNx deposition. The Fourier infrared spectroscopy (FTIR) was used for binding ratio analysis within SiNx:H layers. The influence of plasma-hydrogen etching on the minority carrier lifetime was measured by MW-PCD method.
- This work deals with alternative method for mono-crystalline surface cleaning and activation by means of low pressure plasma-hydrogen etching. The gas mixture of Ar/H2 is used for etch process. Hydrogen plasma etching can removes native oxide layer very efficiently and also it facilitates high-quality passivation effect due to the silicon surface hydrogenation. A reactive SiNx:H sputtering process follows after the plasma-hydrogen etching process using the Ar/N2/H2 gas mixture. Both etching and sputtering are performed in one vacuum cycle. The aim of such processing is in elimination of SiOX interlayer formation that could be created on the substrate can lead to formation of very thin SiOxNy layer on the silicon/layer interface after start of SiNx deposition. The Fourier infrared spectroscopy (FTIR) was used for binding ratio analysis within SiNx:H layers. The influence of plasma-hydrogen etching on the minority carrier lifetime was measured by MW-PCD method. (en)
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Title
| - Deposition of Sputtered SiNx:H Passivation Layers Using Hydrogen Plasma Etching for Silicon Surface Preparation
- Deposition of Sputtered SiNx:H Passivation Layers Using Hydrogen Plasma Etching for Silicon Surface Preparation (en)
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skos:prefLabel
| - Deposition of Sputtered SiNx:H Passivation Layers Using Hydrogen Plasma Etching for Silicon Surface Preparation
- Deposition of Sputtered SiNx:H Passivation Layers Using Hydrogen Plasma Etching for Silicon Surface Preparation (en)
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skos:notation
| - RIV/00216305:26220/09:PU82087!RIV10-MSM-26220___
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http://linked.open...avai/riv/aktivita
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http://linked.open...avai/riv/aktivity
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http://linked.open...vai/riv/dodaniDat
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http://linked.open...aciTvurceVysledku
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http://linked.open.../riv/druhVysledku
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http://linked.open...iv/duvernostUdaju
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http://linked.open...titaPredkladatele
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http://linked.open...dnocenehoVysledku
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http://linked.open...ai/riv/idVysledku
| - RIV/00216305:26220/09:PU82087
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http://linked.open...riv/jazykVysledku
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http://linked.open.../riv/klicovaSlova
| - hydrogenation, silicon surface, silicon nitride, passivation layer, magnetron sputtering (en)
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http://linked.open.../riv/klicoveSlovo
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http://linked.open...ontrolniKodProRIV
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http://linked.open...v/mistoKonaniAkce
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http://linked.open...i/riv/mistoVydani
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http://linked.open...i/riv/nazevZdroje
| - 24th European Photovoltaic Solar Energy Conference and Exhibition
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http://linked.open...in/vavai/riv/obor
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http://linked.open...ichTvurcuVysledku
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http://linked.open...cetTvurcuVysledku
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http://linked.open...UplatneniVysledku
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http://linked.open...iv/tvurceVysledku
| - Bařinka, Radim
- Fořt, Tomáš
- Poruba, Aleš
- Sobota, Jaroslav
- Boušek, Jaroslav
- Hégr, Ondřej
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http://linked.open...vavai/riv/typAkce
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http://linked.open.../riv/zahajeniAkce
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http://linked.open...n/vavai/riv/zamer
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number of pages
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http://purl.org/ne...btex#hasPublisher
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https://schema.org/isbn
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http://localhost/t...ganizacniJednotka
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