About: Environment-friendly LF Solder SAC 305 and Its Reliability

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	The article discusses the factors affecting the reliability and the longevity of soldering joints. It introduces the first results of the practical testing of the impact both of varied surfacing methods and the different base material's thickness on the longevity of soldering joints executed by the leadless solder SAC 305. The testing boards are periodically left open for the impact of the temperatures between 0 to +100, with the delay of 15 minutes at the maximum temperature. Before the test itself the boards were aged at increased temperature according to the standard of IPC-SM-785. The first gained experimental data - number of cycles before the failure - were evaluated with the help of Weibull distribution in a graphical form.. The article discusses the factors affecting the reliability and the longevity of soldering joints. It introduces the first results of the practical testing of the impact both of varied surfacing methods and the different base material's thickness on the longevity of soldering joints executed by the leadless solder SAC 305. The testing boards are periodically left open for the impact of the temperatures between 0 to +100, with the delay of 15 minutes at the maximum temperature. Before the test itself the boards were aged at increased temperature according to the standard of IPC-SM-785. The first gained experimental data - number of cycles before the failure - were evaluated with the help of Weibull distribution in a graphical form.. (en)
Title	Environment-friendly LF Solder SAC 305 and Its Reliability Environment-friendly LF Solder SAC 305 and Its Reliability (en)
skos:prefLabel	Environment-friendly LF Solder SAC 305 and Its Reliability Environment-friendly LF Solder SAC 305 and Its Reliability (en)
skos:notation	RIV/00216305:26220/09:PU80582!RIV10-MSM-26220___
http://linked.open...avai/riv/aktivita	Z
http://linked.open...avai/riv/aktivity	Z(MSM0021630503)
http://linked.open...vai/riv/dodaniDat	2010
http://linked.open...aciTvurceVysledku	Šandera, Josef Švecová, Olga
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	313391
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/09:PU80582
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	Lead-free solder, solder joint, reliability, Weibull distribution (en)
http://linked.open.../riv/klicoveSlovo	Weibull distribution reliability solder joint Lead-free solder
http://linked.open...ontrolniKodProRIV	[767F59C6E63F]
http://linked.open...v/mistoKonaniAkce	Brno
http://linked.open...i/riv/mistoVydani	Brno
http://linked.open...i/riv/nazevZdroje	ISSE 2009 32nd International Spring Seminar on Electronics Technology. 2009. Hetero System Integration, the path to New Solutions in the Modern Electronics. Abstracts Proceedings.
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	2 (xsd:int)
http://linked.open...cetTvurcuVysledku	2 (xsd:int)
http://linked.open...UplatneniVysledku	2009
http://linked.open...iv/tvurceVysledku	Šandera, Josef Švecová, Olga
http://linked.open...vavai/riv/typAkce	EUR - Evropská
http://linked.open.../riv/zahajeniAkce	2009-05-13 (xsd:date)
http://linked.open...n/vavai/riv/zamer	Nové trendy v mikroelektronických systémech a nanotechnologiích (MIKROSYN)
number of pages	5 (xsd:int)
http://purl.org/ne...btex#hasPublisher	Novpress s.r.o.
https://schema.org/isbn	978-1-4244-4260-7
http://localhost/t...ganizacniJednotka	26220

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