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About:
Wire Bonding Power Interconnection
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An Entity of Type :
http://linked.opendata.cz/ontology/domain/vavai/Vysledek
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linked.opendata.cz
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http://linked.opendata.cz/ontology/domain/vavai/Vysledek
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skos:Concept
http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description
This paper describes wirebonding power interconnection of silicon chips up to 10A.
This paper describes wirebonding power interconnection of silicon chips up to 10A.
(en)
Title
Wire Bonding Power Interconnection
Wire Bonding Power Interconnection
(en)
skos:prefLabel
Wire Bonding Power Interconnection
Wire Bonding Power Interconnection
(en)
skos:notation
RIV/00216305:26220/08:PU75916!RIV10-MSM-26220___
http://linked.open...avai/riv/aktivita
P
Z
http://linked.open...avai/riv/aktivity
P(FT-TA3/013), Z(MSM0021630503)
http://linked.open...vai/riv/dodaniDat
2010
http://linked.open...aciTvurceVysledku
Novotný, Marek
Szendiuch, Ivan
http://linked.open.../riv/druhVysledku
D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju
S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele
Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku
405806
http://linked.open...ai/riv/idVysledku
RIV/00216305:26220/08:PU75916
http://linked.open...riv/jazykVysledku
eng - angličtina
http://linked.open.../riv/klicovaSlova
ANSYS, chip interconnection, current density, thermomechanical stressing
(en)
http://linked.open.../riv/klicoveSlovo
current density
chip interconnection
thermomechanical stressing
ANSYS
http://linked.open...ontrolniKodProRIV
[5A5A6ED3777F]
http://linked.open...v/mistoKonaniAkce
Greenwich
http://linked.open...i/riv/mistoVydani
London, UK
http://linked.open...i/riv/nazevZdroje
ESTC 2008 Proceedings
http://linked.open...in/vavai/riv/obor
JA
http://linked.open...ichTvurcuVysledku
2
(
xsd:int
)
http://linked.open...cetTvurcuVysledku
2
(
xsd:int
)
http://linked.open...vavai/riv/projekt
*MERIT - Measurement environment for the reliability study of interconnection technologies.
http://linked.open...UplatneniVysledku
2008
http://linked.open...iv/tvurceVysledku
Szendiuch, Ivan
Novotný, Marek
http://linked.open...vavai/riv/typAkce
WRD - Světová
http://linked.open.../riv/zahajeniAkce
2008-09-01
(
xsd:date
)
http://linked.open...n/vavai/riv/zamer
Nové trendy v mikroelektronických systémech a nanotechnologiích (MIKROSYN)
number of pages
4
(
xsd:int
)
http://purl.org/ne...btex#hasPublisher
Neuveden
https://schema.org/isbn
978-1-4244-2813-7
http://localhost/t...ganizacniJednotka
26220
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