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Description
| - Cílem práce je zlepšení spolehlivosti připojení SMD součástek na organický substrát metodou konečných prvků. Zkoumaný vzorek je vystaven teplotnímu cyklování od -25 do 150 °C s délkou hrany 15 min. Dalším předmětem zkoumání je určení místa z maximální hodnotou pnutí v pájeném spoji,tzn. určení pravděpodobného místa vzniku poruchy u pájeného spoje. Jako nástroj je použit program ANSYS. (cs)
- The aim of this work is to improve reliability of SMD connecting and to increase durability of these structures. Three-dimensional finite element analysis has been applied to determine the time-dependent solder joint fatigue response and under accelerated temperature cycling conditions (-40C to +125C, 15min ramps/15min dwells). And definition place with maximal stress value rising in solder joint under shearing. This paper describes recent developments made to the finite element modeling of SMD, exxtending its capability to handle viscoplastic behaviour. It also presents the validation of this approach and results obtained for an SMD. Lifetime predictions are made using the creep strain energy based models of Darveaux. This study discusses the analysis methodologies as implemented in the ANSYS finite element simulation software tool.
- The aim of this work is to improve reliability of SMD connecting and to increase durability of these structures. Three-dimensional finite element analysis has been applied to determine the time-dependent solder joint fatigue response and under accelerated temperature cycling conditions (-40C to +125C, 15min ramps/15min dwells). And definition place with maximal stress value rising in solder joint under shearing. This paper describes recent developments made to the finite element modeling of SMD, exxtending its capability to handle viscoplastic behaviour. It also presents the validation of this approach and results obtained for an SMD. Lifetime predictions are made using the creep strain energy based models of Darveaux. This study discusses the analysis methodologies as implemented in the ANSYS finite element simulation software tool. (en)
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Title
| - Finite Element Modeling of Surface Mount Devices
- Finite Element Modeling of Surface Mount Devices (en)
- Modelování SMD metodou konečných prvků (cs)
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skos:prefLabel
| - Finite Element Modeling of Surface Mount Devices
- Finite Element Modeling of Surface Mount Devices (en)
- Modelování SMD metodou konečných prvků (cs)
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skos:notation
| - RIV/00216305:26220/05:PU49943!RIV06-GA0-26220___
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http://linked.open.../vavai/riv/strany
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http://linked.open...avai/riv/aktivita
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http://linked.open...avai/riv/aktivity
| - P(GA102/04/0590), Z(MSM0021630503)
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http://linked.open...vai/riv/dodaniDat
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http://linked.open...aciTvurceVysledku
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http://linked.open.../riv/druhVysledku
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http://linked.open...iv/duvernostUdaju
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http://linked.open...titaPredkladatele
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http://linked.open...dnocenehoVysledku
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http://linked.open...ai/riv/idVysledku
| - RIV/00216305:26220/05:PU49943
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http://linked.open...riv/jazykVysledku
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http://linked.open.../riv/klicovaSlova
| - finite element modeling, SMD, thermomechanical stressing (en)
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http://linked.open.../riv/klicoveSlovo
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http://linked.open...ontrolniKodProRIV
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http://linked.open...v/mistoKonaniAkce
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http://linked.open...i/riv/mistoVydani
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http://linked.open...i/riv/nazevZdroje
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http://linked.open...in/vavai/riv/obor
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http://linked.open...ichTvurcuVysledku
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http://linked.open...cetTvurcuVysledku
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http://linked.open...vavai/riv/projekt
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http://linked.open...UplatneniVysledku
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http://linked.open...iv/tvurceVysledku
| - Szendiuch, Ivan
- Novotný, Marek
- Bulva, Jindřich
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http://linked.open...vavai/riv/typAkce
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http://linked.open.../riv/zahajeniAkce
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http://linked.open...n/vavai/riv/zamer
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number of pages
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http://purl.org/ne...btex#hasPublisher
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https://schema.org/isbn
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http://localhost/t...ganizacniJednotka
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