About: Finite Element Modeling of Surface Mount Devices

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	Cílem práce je zlepšení spolehlivosti připojení SMD součástek na organický substrát metodou konečných prvků. Zkoumaný vzorek je vystaven teplotnímu cyklování od -25 do 150 °C s délkou hrany 15 min. Dalším předmětem zkoumání je určení místa z maximální hodnotou pnutí v pájeném spoji,tzn. určení pravděpodobného místa vzniku poruchy u pájeného spoje. Jako nástroj je použit program ANSYS. (cs) The aim of this work is to improve reliability of SMD connecting and to increase durability of these structures. Three-dimensional finite element analysis has been applied to determine the time-dependent solder joint fatigue response and under accelerated temperature cycling conditions (-40C to +125C, 15min ramps/15min dwells). And definition place with maximal stress value rising in solder joint under shearing. This paper describes recent developments made to the finite element modeling of SMD, exxtending its capability to handle viscoplastic behaviour. It also presents the validation of this approach and results obtained for an SMD. Lifetime predictions are made using the creep strain energy based models of Darveaux. This study discusses the analysis methodologies as implemented in the ANSYS finite element simulation software tool. The aim of this work is to improve reliability of SMD connecting and to increase durability of these structures. Three-dimensional finite element analysis has been applied to determine the time-dependent solder joint fatigue response and under accelerated temperature cycling conditions (-40C to +125C, 15min ramps/15min dwells). And definition place with maximal stress value rising in solder joint under shearing. This paper describes recent developments made to the finite element modeling of SMD, exxtending its capability to handle viscoplastic behaviour. It also presents the validation of this approach and results obtained for an SMD. Lifetime predictions are made using the creep strain energy based models of Darveaux. This study discusses the analysis methodologies as implemented in the ANSYS finite element simulation software tool. (en)
Title	Finite Element Modeling of Surface Mount Devices Finite Element Modeling of Surface Mount Devices (en) Modelování SMD metodou konečných prvků (cs)
skos:prefLabel	Finite Element Modeling of Surface Mount Devices Finite Element Modeling of Surface Mount Devices (en) Modelování SMD metodou konečných prvků (cs)
skos:notation	RIV/00216305:26220/05:PU49943!RIV06-GA0-26220___
http://linked.open.../vavai/riv/strany	97-101
http://linked.open...avai/riv/aktivita	P Z
http://linked.open...avai/riv/aktivity	P(GA102/04/0590), Z(MSM0021630503)
http://linked.open...vai/riv/dodaniDat	2006
http://linked.open...aciTvurceVysledku	Novotný, Marek Bulva, Jindřich Szendiuch, Ivan
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	521698
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/05:PU49943
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	finite element modeling, SMD, thermomechanical stressing (en)
http://linked.open.../riv/klicoveSlovo	SMD finite element modeling thermomechanical stressing
http://linked.open...ontrolniKodProRIV	[BD104076E773]
http://linked.open...v/mistoKonaniAkce	Wiener Neustadt
http://linked.open...i/riv/mistoVydani	Wien
http://linked.open...i/riv/nazevZdroje	Proceedings of ISSE 2005
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	3 (xsd:int)
http://linked.open...cetTvurcuVysledku	3 (xsd:int)
http://linked.open...vavai/riv/projekt	Development of microelectronics technologies for 3D circuits and systems
http://linked.open...UplatneniVysledku	2005
http://linked.open...iv/tvurceVysledku	Szendiuch, Ivan Novotný, Marek Bulva, Jindřich
http://linked.open...vavai/riv/typAkce	EUR - Evropská
http://linked.open.../riv/zahajeniAkce	2005-05-19 (xsd:date)
http://linked.open...n/vavai/riv/zamer	Nové trendy v mikroelektronických systémech a nanotechnologiích (MIKROSYN)
number of pages	5 (xsd:int)
http://purl.org/ne...btex#hasPublisher	TU Wien
https://schema.org/isbn	0-7803-9325-2
http://localhost/t...ganizacniJednotka	26220

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