About: Reliability of Solder Joint and SMT Assembly

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	The simulation of thermomechanical stress in SMD chip components is presented.Special mechanical system with low temperature capacity for measuring of reliability is designed and presented. Popisuje simulaci termomechanického pnutí na SMD součástce. Byl vyvinut speciální systém pro měření spolehlivosti. (cs) The simulation of thermomechanical stress in SMD chip components is presented.Special mechanical system with low temperature capacity for measuring of reliability is designed and presented. The simulation of thermomechanical stress in SMD chip components is presented.Special mechanical system with low temperature capacity for measuring of reliability is designed and presented. (en)
Title	Reliability of Solder Joint and SMT Assembly Reliability of Solder Joint and SMT Assembly (en) Spolehlivost pájeného spoje u povrchové montáže (cs)
skos:prefLabel	Reliability of Solder Joint and SMT Assembly Reliability of Solder Joint and SMT Assembly (en) Spolehlivost pájeného spoje u povrchové montáže (cs)
skos:notation	RIV/00216305:26220/05:PU47412!RIV06-GA0-26220___
http://linked.open.../vavai/riv/strany	25-28
http://linked.open...avai/riv/aktivita	P Z
http://linked.open...avai/riv/aktivity	P(GA102/04/0590), Z(MSM 262200022)
http://linked.open...vai/riv/dodaniDat	2006
http://linked.open...aciTvurceVysledku	Šandera, Josef
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	540708
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/05:PU47412
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	thermomechanical stress, software ANSYS, 1206 chip component, mechanical construction for temperature cycling (en)
http://linked.open.../riv/klicoveSlovo	1206 chip component mechanical construction for temperature cycling software ANSYS thermomechanical stress
http://linked.open...ontrolniKodProRIV	[DF2DF1BE51B8]
http://linked.open...v/mistoKonaniAkce	Tarragona
http://linked.open...i/riv/mistoVydani	Tarragona, Španělsko
http://linked.open...i/riv/nazevZdroje	2005-Spanish Conference on Electron Devices
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	1 (xsd:int)
http://linked.open...cetTvurcuVysledku	1 (xsd:int)
http://linked.open...vavai/riv/projekt	Development of microelectronics technologies for 3D circuits and systems
http://linked.open...UplatneniVysledku	2005
http://linked.open...iv/tvurceVysledku	Šandera, Josef
http://linked.open...vavai/riv/typAkce	WRD - Světová
http://linked.open.../riv/zahajeniAkce	2005-02-02 (xsd:date)
http://linked.open...n/vavai/riv/zamer	http://linked.opendata.cz/resource/domain/vavai/zamer/MSM%20262200022
number of pages	4 (xsd:int)
http://purl.org/ne...btex#hasPublisher	Neuveden
https://schema.org/isbn	0-7803-8811-9
http://localhost/t...ganizacniJednotka	26220

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