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Description
  • Příspěvek je zaměřen na termomechaniké modelování dvou substrátů s různým CTE. Jedním z materiálů je laminát FR4, druhým je keramika Al2O3 nebo AlN. Spojení substrátů je realizováno pomocí pájených spojů. Ty jsou sjou tvořeny bezolovnatou pájkou SnAgCu nebo eutektickou pájkou SnPb. (cs)
  • This paper describes thermomechanical modelling of connection of two different materials, which are often used in electronic devices - organics FR4 and two ceramics material Al2O3 and AlN. There are investigated combinations organic-organic, organic-ceramic, ceramic-ceramic, connected with eutectic SnPb solder or lead free solder SnAgCu.
  • This paper describes thermomechanical modelling of connection of two different materials, which are often used in electronic devices - organics FR4 and two ceramics material Al2O3 and AlN. There are investigated combinations organic-organic, organic-ceramic, ceramic-ceramic, connected with eutectic SnPb solder or lead free solder SnAgCu. (en)
Title
  • 2D modelovani mechanickeho napeti v pajenych spojich (cs)
  • 2D Modelling of Stresses in Solder Joint Connection
  • 2D Modelling of Stresses in Solder Joint Connection (en)
skos:prefLabel
  • 2D modelovani mechanickeho napeti v pajenych spojich (cs)
  • 2D Modelling of Stresses in Solder Joint Connection
  • 2D Modelling of Stresses in Solder Joint Connection (en)
skos:notation
  • RIV/00216305:26220/04:PU44038!RIV06-GA0-26220___
http://linked.open.../vavai/riv/strany
  • 377-756
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • P(GA102/04/0590), Z(MSM 262200022)
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 596584
http://linked.open...ai/riv/idVysledku
  • RIV/00216305:26220/04:PU44038
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • ANSYS, modelling, solder joint quality (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [2BC9D5E53B86]
http://linked.open...v/mistoKonaniAkce
  • Brno
http://linked.open...i/riv/mistoVydani
  • Brno
http://linked.open...i/riv/nazevZdroje
  • 11th Electronic Devices and Systems Conference 2004 Proceedings
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...vavai/riv/projekt
http://linked.open...UplatneniVysledku
http://linked.open...iv/tvurceVysledku
  • Szendiuch, Ivan
  • Bulva, Jindřich
http://linked.open...vavai/riv/typAkce
http://linked.open.../riv/zahajeniAkce
http://linked.open...n/vavai/riv/zamer
number of pages
http://purl.org/ne...btex#hasPublisher
  • Ing. Zdeněk Novotný CSc.
https://schema.org/isbn
  • 80-214-2701-9
http://localhost/t...ganizacniJednotka
  • 26220
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