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rdf:type
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Description
| - Příspěvek je zaměřen na termomechaniké modelování dvou substrátů s různým CTE. Jedním z materiálů je laminát FR4, druhým je keramika Al2O3 nebo AlN. Spojení substrátů je realizováno pomocí pájených spojů. Ty jsou sjou tvořeny bezolovnatou pájkou SnAgCu nebo eutektickou pájkou SnPb. (cs)
- This paper describes thermomechanical modelling of connection of two different materials, which are often used in electronic devices - organics FR4 and two ceramics material Al2O3 and AlN. There are investigated combinations organic-organic, organic-ceramic, ceramic-ceramic, connected with eutectic SnPb solder or lead free solder SnAgCu.
- This paper describes thermomechanical modelling of connection of two different materials, which are often used in electronic devices - organics FR4 and two ceramics material Al2O3 and AlN. There are investigated combinations organic-organic, organic-ceramic, ceramic-ceramic, connected with eutectic SnPb solder or lead free solder SnAgCu. (en)
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Title
| - 2D modelovani mechanickeho napeti v pajenych spojich (cs)
- 2D Modelling of Stresses in Solder Joint Connection
- 2D Modelling of Stresses in Solder Joint Connection (en)
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skos:prefLabel
| - 2D modelovani mechanickeho napeti v pajenych spojich (cs)
- 2D Modelling of Stresses in Solder Joint Connection
- 2D Modelling of Stresses in Solder Joint Connection (en)
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skos:notation
| - RIV/00216305:26220/04:PU44038!RIV06-GA0-26220___
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http://linked.open.../vavai/riv/strany
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http://linked.open...avai/riv/aktivita
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http://linked.open...avai/riv/aktivity
| - P(GA102/04/0590), Z(MSM 262200022)
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http://linked.open...vai/riv/dodaniDat
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http://linked.open...aciTvurceVysledku
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http://linked.open.../riv/druhVysledku
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http://linked.open...iv/duvernostUdaju
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http://linked.open...titaPredkladatele
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http://linked.open...dnocenehoVysledku
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http://linked.open...ai/riv/idVysledku
| - RIV/00216305:26220/04:PU44038
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http://linked.open...riv/jazykVysledku
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http://linked.open.../riv/klicovaSlova
| - ANSYS, modelling, solder joint quality (en)
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http://linked.open.../riv/klicoveSlovo
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http://linked.open...ontrolniKodProRIV
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http://linked.open...v/mistoKonaniAkce
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http://linked.open...i/riv/mistoVydani
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http://linked.open...i/riv/nazevZdroje
| - 11th Electronic Devices and Systems Conference 2004 Proceedings
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http://linked.open...in/vavai/riv/obor
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http://linked.open...ichTvurcuVysledku
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http://linked.open...cetTvurcuVysledku
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http://linked.open...vavai/riv/projekt
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http://linked.open...UplatneniVysledku
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http://linked.open...iv/tvurceVysledku
| - Szendiuch, Ivan
- Bulva, Jindřich
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http://linked.open...vavai/riv/typAkce
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http://linked.open.../riv/zahajeniAkce
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http://linked.open...n/vavai/riv/zamer
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number of pages
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http://purl.org/ne...btex#hasPublisher
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https://schema.org/isbn
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http://localhost/t...ganizacniJednotka
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