Attributes | Values |
---|
rdf:type
| |
Description
| - Electronic assembly tries to reach low cost and very fast design-to-production process. The stacked packages are one of possible ways of solution. This article focuses on thermomechanical modelling of two materials with different CTE, which are commonly used in today's electronic devices - FR4 and ceramic material 96%Al2O3. These substrates are connected with lead free solder SnAgCu. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of therrmomechanical properties of MSMs when solder bumps changed diameter.
- Electronic assembly tries to reach low cost and very fast design-to-production process. The stacked packages are one of possible ways of solution. This article focuses on thermomechanical modelling of two materials with different CTE, which are commonly used in today's electronic devices - FR4 and ceramic material 96%Al2O3. These substrates are connected with lead free solder SnAgCu. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of therrmomechanical properties of MSMs when solder bumps changed diameter. (en)
|
Title
| - Modelling of 3D Multimodule Substrate
- Modelling of 3D Multimodule Substrate (en)
|
skos:prefLabel
| - Modelling of 3D Multimodule Substrate
- Modelling of 3D Multimodule Substrate (en)
|
skos:notation
| - RIV/00216305:26220/03:PU37823!RIV/2004/MSM/262204/N
|
http://linked.open.../vavai/riv/strany
| |
http://linked.open...avai/riv/aktivita
| |
http://linked.open...avai/riv/aktivity
| |
http://linked.open...vai/riv/dodaniDat
| |
http://linked.open...aciTvurceVysledku
| |
http://linked.open.../riv/druhVysledku
| |
http://linked.open...iv/duvernostUdaju
| |
http://linked.open...titaPredkladatele
| |
http://linked.open...dnocenehoVysledku
| |
http://linked.open...ai/riv/idVysledku
| - RIV/00216305:26220/03:PU37823
|
http://linked.open...riv/jazykVysledku
| |
http://linked.open.../riv/klicovaSlova
| - MSM, reliability, thermomechanical properties, packaging, modelling, ANSYS (en)
|
http://linked.open.../riv/klicoveSlovo
| |
http://linked.open...ontrolniKodProRIV
| |
http://linked.open...v/mistoKonaniAkce
| - Ostaniec Hotel, Podlesice, Gliwice, Poland
|
http://linked.open...i/riv/mistoVydani
| |
http://linked.open...i/riv/nazevZdroje
| - Proceedings of 27-th International Conference and Exhibition IMAPS-Poland 2003
|
http://linked.open...in/vavai/riv/obor
| |
http://linked.open...ichTvurcuVysledku
| |
http://linked.open...cetTvurcuVysledku
| |
http://linked.open...ocetUcastnikuAkce
| |
http://linked.open...nichUcastnikuAkce
| |
http://linked.open...UplatneniVysledku
| |
http://linked.open...iv/tvurceVysledku
| - Szendiuch, Ivan
- Bulva, Jindřich
|
http://linked.open...vavai/riv/typAkce
| |
http://linked.open.../riv/zahajeniAkce
| |
http://linked.open...n/vavai/riv/zamer
| |
number of pages
| |
http://purl.org/ne...btex#hasPublisher
| - International Microelectronics and Packaging Society Poland-Chapter
|
https://schema.org/isbn
| |
http://localhost/t...ganizacniJednotka
| |