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Description
  • Electronic assembly tries to reach low cost and very fast design-to-production process. The stacked packages are one of possible ways of solution. This article focuses on thermomechanical modelling of two materials with different CTE, which are commonly used in today's electronic devices - FR4 and ceramic material 96%Al2O3. These substrates are connected with lead free solder SnAgCu. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of therrmomechanical properties of MSMs when solder bumps changed diameter.
  • Electronic assembly tries to reach low cost and very fast design-to-production process. The stacked packages are one of possible ways of solution. This article focuses on thermomechanical modelling of two materials with different CTE, which are commonly used in today's electronic devices - FR4 and ceramic material 96%Al2O3. These substrates are connected with lead free solder SnAgCu. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of therrmomechanical properties of MSMs when solder bumps changed diameter. (en)
Title
  • Modelling of 3D Multimodule Substrate
  • Modelling of 3D Multimodule Substrate (en)
skos:prefLabel
  • Modelling of 3D Multimodule Substrate
  • Modelling of 3D Multimodule Substrate (en)
skos:notation
  • RIV/00216305:26220/03:PU37823!RIV/2004/MSM/262204/N
http://linked.open.../vavai/riv/strany
  • 126-129
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • Z(MSM 262200022)
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 615951
http://linked.open...ai/riv/idVysledku
  • RIV/00216305:26220/03:PU37823
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • MSM, reliability, thermomechanical properties, packaging, modelling, ANSYS (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [8E784F6371A3]
http://linked.open...v/mistoKonaniAkce
  • Ostaniec Hotel, Podlesice, Gliwice, Poland
http://linked.open...i/riv/mistoVydani
  • Gliwice, Poland
http://linked.open...i/riv/nazevZdroje
  • Proceedings of 27-th International Conference and Exhibition IMAPS-Poland 2003
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...ocetUcastnikuAkce
http://linked.open...nichUcastnikuAkce
http://linked.open...UplatneniVysledku
http://linked.open...iv/tvurceVysledku
  • Szendiuch, Ivan
  • Bulva, Jindřich
http://linked.open...vavai/riv/typAkce
http://linked.open.../riv/zahajeniAkce
http://linked.open...n/vavai/riv/zamer
number of pages
http://purl.org/ne...btex#hasPublisher
  • International Microelectronics and Packaging Society Poland-Chapter
https://schema.org/isbn
  • 83-917701-0-9
http://localhost/t...ganizacniJednotka
  • 26220
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