About: Multi Substrate Modules – Cheap Solution for 3D Packaging

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

Attributes	Values
rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	The stacked packages are one of the most significant advances for building modern electronic systems. They give a good opportunity to built high volume three-dimensional devices with requested quality. 3D packages deliver volumetric density through vertical stacking. This method integrates multiple substrates and chips in a package to provide higher levels of functionality that can be achieved through multiple package solutions technologies. The aim of this paper is to describe and discuss some of the possible solutions, which are currently followed by research project of the Czech Ministry of Education in the frame of Research Plan MSM 262200022 “MIKROSYT Microelectronic Systems and Technologies”, and at the same time by the Grant project FRVS IS 421920 “Innovation of Education of Microelectronics Assembly Technologies”. The stacked packages are one of the most significant advances for building modern electronic systems. They give a good opportunity to built high volume three-dimensional devices with requested quality. 3D packages deliver volumetric density through vertical stacking. This method integrates multiple substrates and chips in a package to provide higher levels of functionality that can be achieved through multiple package solutions technologies. The aim of this paper is to describe and discuss some of the possible solutions, which are currently followed by research project of the Czech Ministry of Education in the frame of Research Plan MSM 262200022 “MIKROSYT Microelectronic Systems and Technologies”, and at the same time by the Grant project FRVS IS 421920 “Innovation of Education of Microelectronics Assembly Technologies”. (en)
Title	Multi Substrate Modules – Cheap Solution for 3D Packaging Multi Substrate Modules – Cheap Solution for 3D Packaging (en)
skos:prefLabel	Multi Substrate Modules – Cheap Solution for 3D Packaging Multi Substrate Modules – Cheap Solution for 3D Packaging (en)
skos:notation	RIV/00216305:26220/02:PU29309!RIV/2003/MSM/262203/N
http://linked.open.../vavai/riv/strany	114-235
http://linked.open...avai/riv/aktivita	Z
http://linked.open...avai/riv/aktivity	Z(MSM 262200022)
http://linked.open...vai/riv/dodaniDat	2003
http://linked.open...aciTvurceVysledku	Szendiuch, Ivan Šandera, Josef Bílek, Jaromír
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	654567
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/02:PU29309
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	3D structures, Stacking, Multi Substrate Modules (MSM), Ball-terminal, Edge-terminal (en)
http://linked.open.../riv/klicoveSlovo	3D structures Stacking Ball-terminal Edge-terminal Multi Substrate Modules (MSM)
http://linked.open...ontrolniKodProRIV	[FFA106DE4405]
http://linked.open...v/mistoKonaniAkce	Stockholm
http://linked.open...i/riv/mistoVydani	Kiiminki, Finland
http://linked.open...i/riv/nazevZdroje	Proceedings of The IMAPS Nordic Annual Conference Stockholm, 2002
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	3 (xsd:int)
http://linked.open...cetTvurcuVysledku	3 (xsd:int)
http://linked.open...ocetUcastnikuAkce	0 (xsd:int)
http://linked.open...nichUcastnikuAkce	0 (xsd:int)
http://linked.open...UplatneniVysledku	2002
http://linked.open...iv/tvurceVysledku	Szendiuch, Ivan Šandera, Josef Bílek, Jaromír
http://linked.open...vavai/riv/typAkce	WRD - Světová
http://linked.open.../riv/zahajeniAkce	2002-09-29 (xsd:date)
http://linked.open...n/vavai/riv/zamer	http://linked.opendata.cz/resource/domain/vavai/zamer/MSM%20262200022
number of pages	122 (xsd:int)
http://purl.org/ne...btex#hasPublisher	Pelkosen Painotuote
https://schema.org/isbn	951-98002-4-7
http://localhost/t...ganizacniJednotka	26220

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