About: Influence of the CTE on Mechanical Stress of Chip SMD Components

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	This paper describes the reasons of mechanical stress of SMD chip components soldered on FR4 substrate caused by thermal changes on board. There is especially presented a simulation of mechanical stress in volume ceramic capacitor body in 1206 package. Simulation ANSYS program for finite element analysis and design is used. This paper describes the reasons of mechanical stress of SMD chip components soldered on FR4 substrate caused by thermal changes on board. There is especially presented a simulation of mechanical stress in volume ceramic capacitor body in 1206 package. Simulation ANSYS program for finite element analysis and design is used. (en)
Title	Influence of the CTE on Mechanical Stress of Chip SMD Components Influence of the CTE on Mechanical Stress of Chip SMD Components (en)
skos:prefLabel	Influence of the CTE on Mechanical Stress of Chip SMD Components Influence of the CTE on Mechanical Stress of Chip SMD Components (en)
skos:notation	RIV/00216305:26220/02:PU29275!RIV/2003/MSM/262203/N
http://linked.open.../vavai/riv/strany	92-96
http://linked.open...avai/riv/aktivita	Z
http://linked.open...avai/riv/aktivity	Z(MSM 262200022)
http://linked.open...vai/riv/dodaniDat	2003
http://linked.open...aciTvurceVysledku	Hejátková, Edita Šandera, Josef
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	648984
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/02:PU29275
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	SMT, Chip Component, Coefficient of Thermal Expansion, Effective Stress, ANSYS simulation software, 1206 chip component (en)
http://linked.open.../riv/klicoveSlovo	SMT 1206 chip component ANSYS simulation software Chip Component Coefficient of Thermal Expansion Effective Stress
http://linked.open...ontrolniKodProRIV	[0DAC178DB998]
http://linked.open...v/mistoKonaniAkce	Chania, Crete
http://linked.open...i/riv/mistoVydani	Brno
http://linked.open...i/riv/nazevZdroje	Socrates Workshop 2002 - Proceedings
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	2 (xsd:int)
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http://linked.open...ocetUcastnikuAkce	0 (xsd:int)
http://linked.open...nichUcastnikuAkce	0 (xsd:int)
http://linked.open...UplatneniVysledku	2002
http://linked.open...iv/tvurceVysledku	Hejátková, Edita Šandera, Josef
http://linked.open...vavai/riv/typAkce	EUR - Evropská
http://linked.open.../riv/zahajeniAkce	2002-09-02 (xsd:date)
http://linked.open...n/vavai/riv/zamer	http://linked.opendata.cz/resource/domain/vavai/zamer/MSM%20262200022
number of pages	5 (xsd:int)
http://purl.org/ne...btex#hasPublisher	Neuveden
https://schema.org/isbn	80-214-2217-3
http://localhost/t...ganizacniJednotka	26220

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