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Description
  • The analysis addresses a typical failure development pattern in thin films consisting of a system of multiple surface cracks leading to and branching along or near the interface between the film and the base material. The process is driven by thermal residual stresses and/or mechanical loading.
  • The analysis addresses a typical failure development pattern in thin films consisting of a system of multiple surface cracks leading to and branching along or near the interface between the film and the base material. The process is driven by thermal residual stresses and/or mechanical loading. (en)
Title
  • Analysis of multiple cracks in thin coating on orthotropic substrate under mechanical and residual stresses
  • Analysis of multiple cracks in thin coating on orthotropic substrate under mechanical and residual stresses (en)
skos:prefLabel
  • Analysis of multiple cracks in thin coating on orthotropic substrate under mechanical and residual stresses
  • Analysis of multiple cracks in thin coating on orthotropic substrate under mechanical and residual stresses (en)
skos:notation
  • RIV/00216305:26210/09:PU81785!RIV10-GA0-26210___
http://linked.open...avai/riv/aktivita
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  • P(GA101/09/1821)
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  • 2
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  • 302901
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  • RIV/00216305:26210/09:PU81785
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  • Multiple cracks, Surface layer, Interface,Thermal stresses, Matched asymptotic expansions, Reciprocal theorem (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...odStatuVydavatele
  • US - Spojené státy americké
http://linked.open...ontrolniKodProRIV
  • [7A7B24E98A34]
http://linked.open...i/riv/nazevZdroje
  • Engineering Fracture Mechanics
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  • 77
http://linked.open...iv/tvurceVysledku
  • Kotoul, Michal
  • Profant, Tomáš
  • Ševeček, Oldřich
issn
  • 0013-7944
number of pages
http://localhost/t...ganizacniJednotka
  • 26210
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